M = 8-lead/16-lead SO packageN = 8-contact WSON/USON packageB = 24-ball 6x8mm BGA package, 1.0mm pitch
X
Package Materials
F = Lead (Pb)-free, Halogen-freeH = Low-halogen, Lead (Pb)-free
X
Temperature Range
A = Industrial, GT Grade, AEC-Q100 Grade 3 (-40°C to +85°C)B = Industrial Plus, GT Grade, AEC-Q100 Grade 2 (-40°C to +105°C)M = Extended, GT Grade, AEC-Q100 Grade 1 (-40°C to +125°C)I = Industrial (-40°C to +85°C)V = Industrial Plus (-40°C to +105°C)N = Extended (-40°C to +125°C)
XX
Model Number (Additional Ordering Options)
00 = 16-lead SO package (300 mil)01 = 8-lead SO package (208 mil) / 8-contact WSON02 = 5 x 5 ball BGA package03 = 4 x 6 ball BGA package04 = 8-lead SO package (150 mil) / 8-contact USON (4 mm / 4 mm)Q1 = 8-lead SO package (208 mil) / 8-contact WSON, (Default quad mode enabled)
X
Packing Type
0Tray1 = Tube3 = 13\'\' Tape and Reel
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.