S | Spansion Memory | |
XX | Product Series | 71 = Multi-chip product (MCP)73 = Stacked products (MCP)98 = Stacked Multi-chip product |
X | Flash Interface And Simultaneous Read-Write | J = Standard, simultaneous read-writeA = Standard, no simultaneous read-writeP = Page, simultaneous read-writeG = Page, no simultaneous read-writeW = Burst (Demux add/data), simultaneous read-writeR = Burst (Demux add/data), no simultaneous read-writeN = Burst (Mux add/data), simultaneous read-writeK = Burst (Mux add/data), no simultaneous read-writeC = Automotive burst (Demux), simultaneous read-writeV = Simultaneous Read/Write, Burst mode with multiplexed I/O |
X | Core Voltage | F = 5.0 V VccL = 3.0 V VccD = 2.5 V VccS = 1.8V Vcc |
XXX | Density | 001-999 = 1Mb - 999Mb01G-64G = 1Gb - 64Gb |
X | Process Technology | B = 320 nm, Floating gate technologyC = 320 nm, Floating gate technologyD = 200 nm, Floating gate technologyG = 170 nm, Floating gate technologyH = 130 nm, Floating gate technologyJ = 110 nm, Floating gate technologyM = 230 nm, MirrorBit technologyA = 200 nm MirrorBit technologyN = 110 nm, MirrorBit technologyP = 90 nm, MirrorBit technologyK = 90 nm, Floating gate technologyR = 65 nm, MirrorBit technology |
XX | pSRAM Density | 04 = 4Mbit SRAM08 = 8Mbit SRAM0A = 16Mbit pSRAM40 = 4Mbit pSRAM80 = 8Mbit pSRAMA0 = 16Mbit pSRAMB0 = 32Mbit pSRAMC0 = 64Mbit pSRAMD0 = 128Mbit pSRAM |
XX | Package Type | B = FBGAC = CSOP (Lead Frame)D = Die (Die/Wafer)E = Super CSP (BGA)F = Fortified BGAM = SOIC/SOP (Lead Frame)N = WSON (Lead Frame)T = TSOPS = SOPH = MCP FBGAK = POP FBGAJ = MCP FBGAZJ = Very thin fine-pitch BGA lead-free LF35 package |
X | Package Material Set | BlankA = Standard, not lead (Pb)-freeF = Standard, lead (PB)-free |
X | Temperature Range | BlankE = Engineering samplesC = Commercial (0°C to 70°C)W = Wireless (-25°C to 85°C)I = Industrial (-40°C to 85°C)N = Extended (-40°C to 125°C) |
X | Package Modifier | Blank0, Q = 7x9mm, 1.2mm height, 56 balls9 = 8x11.6mm, 1.2mm height, 64 ballsT = 8x11.6mm, 1.4mm height, 84 ballsA = 8x11.6mm, 1.2mm height, 84 ballsE = 9x12mm, 1.2mm height, 84 ballsY = 9x12mm, 1.2mm height, 84 ballsK = 7.7x6.2mm, 56-Ball |
X | Model Number 1 | BlankH = CellularRAM type 2, DYB=1, PPB=0S = CellularRAM type 2, DYB=1, PPB=1T = CellularRAM type 3, DYB=1, PPB=14 = SDR DRAM x16, Type 5 |
X | Model Number 2 | BlankV = 66MHz flash speedR = 80Mhz flash speedL = 108MHz flash speed |
X | Packing Type | 0Tray1 = Tube2 = 7\\\'\\\' Tape & Reel3 = 13\'\' Tape & Reel |