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HY
Hynix Memory
27
Device Family
27 = NAND Flash
X
Power Supply
U = 2.7V to 3.6VL = 2.7VS = 1.8V
X
Classification
S = Single Level Cell + Single Die + S/BA = Single Level Cell + Double Die + S/BB = Single Level Cell + Quadruple Die + S/BF = Single Level Cell + Single Die + L/BG = Single Level Cell + Double Die + L/BH = Single Level Cell + Quadruple Die + L/BM = Multi Level Cell + Single Die + S/BO = Multi Level Cell + Double Die + S/BP = Multi Level Cell + Quadruple Die + S/BT = Multi Level Cell + Single Die + L/BU = Multi Level Cell + Double Die + L/BV = Multi Level Cell + Quadruple Die + L/BW = Multi Level Cell + L/B
Blank = Normal, Wafer, Chip, KGBP = Lead FreeH = Halogen FreeR = Lead & Halogen Free
X
Operating Temperature
Blank = Wafer, ChipC = 0°C to 70°CE = -25°C to 85°CM = -30°C to 85°CI = -40°C to 85°C
X
Bad Block
Blank = WaferB = Included Bad BlockS = 1 - 5 Bad BlockP = All Good Block
X
Customer Initial Option
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.