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Device: PC28F256M29EWL [BGA64]

Manufacturer: Intel

Part number description for this device:

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XX Package Type JR = TSOP48, 12 x 20 mm, lead freeJS = TSOP56, 14x20mm, lead freePZ = BGA48, 6 x 8 mm, lead freePC = Fortified BGA64, 11x13, 1mm pitch, lead freeRC = Fortified BGA64, 11x13mm, 1mm pitch, leaded
XXX Discrete/SCSP 28F = Discrete
XXX Device Density 032 = 32Mbit064 = 64Mbit128 = 128Mbit256 = 256Mbit512 = 512Mbit00A = 1Gbit
XXXXX Device Type M29EW = 3V core, page, uniform block flash memory
X Device Function H = Highest block protected by Vpp/WP#L = Lowest block protected by Vpp/WP#B = Bottom boot, bottom two blocks protected by VPP/WP#T = Top boot, top two blocks protected by VPP/WP#

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-0448/0724 (70-0448/0724) = BGA-Bottom-19 (70-0448) + BGA-Top-132 ZIF-CS (70-0724)
BeeHive204AP adapter/module: AP1 BGA64-2.3 ZIF NOR-4 (71-6557) OR
BeeHive208S adapter/module: BGA-0448/0724 (70-0448/0724) = BGA-Bottom-19 (70-0448) + BGA-Top-132 ZIF-CS (70-0724)
BeeHive304 adapter/module: AP3 BGA64-2.3 NOR-1 (73-6094) OR
BeeProg2 adapter/module: BGA-0448/0724 (70-0448/0724) = BGA-Bottom-19 (70-0448) + BGA-Top-132 ZIF-CS (70-0724)
BeeProg2AP adapter/module: AP1 BGA64-2.3 ZIF NOR-4 (71-6557) OR
BeeProg2C adapter/module: BGA-0448/0724 (70-0448/0724) = BGA-Bottom-19 (70-0448) + BGA-Top-132 ZIF-CS (70-0724)
BeeProg3 adapter/module: AP3 BGA64-2.3 NOR-1 (73-6094) OR
BeeHive204AP-AU (discontinued) adapter/module: AP1 BGA64-2.3 ZIF NOR-4 (71-6557) OR
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