Device: S3F8S45 [SDIP32]
Manufacturer: Samsung
Part number description for this device:
Move the cursor over the box to highlight particular sectionS | System LSI | |
3 | Microcontroller | |
X | Family Type | C = Mask ROMF = FLASH3 = MCPE = EVA-CHIPP = OTP |
X | Core | 1 = 51 4-bit2 = 32-bit ARM93 = 17 16-bit4 = 32 32-bit5 = 32-bit ARM106 = 56 4-bit7 = 57 4-bit8 = 88 8-bit9 = 86 8-bitA = 15 OtherB = 8-bit CALM RISC MACC = 16-bit CALM RISC MACD = 32-bit CALM RISC MACI = Custom MCUJ = SC-200K = 8-bit CALM RISCL = 16-bit CALM RISCR = 128-bit CALM RISCS = SC-100 |
XX | Application Category | 0n = General Purpose1n = Voice2n = LCD3n = Audio4n = General A/D5n = Telecom6n = PC & Peripherial, OA7n = VFD8n = Video9n = Special (IC Card)An = General Purpose-1Cn = CFn = Telecom-1Nn = Intel ApplicationZn = Assigment Code "n" Serial No. (1~Z) |
X | ROM Master | 0ROMless1 = 1kx82 = 2kx83 = 12kx84 = 4kx85 = 16kx86 = 6kx87 = 24kx88 = 8kx89 = 32kx8A = 48kx8B = 64kx8C = 96kx8D = 128kx8F = 256kx8G = 384kx8H = 512kx8J = 768kx8K = 1Mx8W = 144kx8 |
X | Version | |
XX | Mask Option | |
XX | Package Type | A = SDIPB = LGAC = Chip BIZD = DIPE = LQFPF = WQFPG = BGAH = CSPJ = BQFPK = UELPL = ELPM = QFPHN = COBP = PLCCR = TSSOPQ = QFPS = SOPT = TQFPV = SSOPW = WafferY = FBGAZ = SBGA |
X | Package Pin | SDIP package:B=56, M=24, O=32, Q=42, T=64, V=30LGA package:A=88, C=83, J=176DIP package:C=8, H=16, I=18, K=20, N=28, P=40LQFP package:C=144, D=160, E=208, G=256, J=176, R=48, T=64, W=80, X=100WQFP package:T=64BGA package:A=272, B=416, C=496, D=153CSP package:J=176BQFP package:B=132UELP package:T=64ELP package:R=48, T=64QFPH package:D=160, F=240COB package:C=8, D=8CNCLPLCC package:C=52, Z=44TSSOP package:R=48QFP package:A=128, C=144, D=160, E=208, G=256, R=48, T=64, U=304, W=80, X=100, Z=44SOP package:C=8, H=16, I=18, K=20, M=24, N=28, O=32TQFP package:A=128, T=64, W=80, X=100TEBGA package:X=492FBGA package:A=337, B=81, C=144, D=160, E=208, F=180, G=285, H=320, K=105,L=400, O=272, P=504, Q=289, T=64, U=83, X=100SBGA package:A=432SSOP package:H=16, K=20 |
X | Packing | B = TubeU = BulkR = TrayT = Tape & ReelS = Tape & Reel reverseC = Chip BizD = Chip Biz (3 inch tray)E = Chip Biz (4 inch tray)F = Chip Biz (reverse)W = WF Biz Draft WaferX = WF Biz Full Cutting7 = Tape & Reel (Pb-Free PKG)8 = Tray (Pb-Free PKG)9 = Tube (Pb-Free PKG) |
X | ROM Size | 0ROMless1 = 1kx82 = 2kx83 = 12kx84 = 4kx85 = 16kx86 = 6kx87 = 24kx88 = 8kx89 = 32kx8A = 48kx8B = 64kx8C = 96kx8D = 128kx8E = ExtendedF = 256kx8G = 384kx8H = 512kx8J = 768kx8K = 1Mx8M = MilitaryN = IndustrialW = 144kx8X = Special MK3Y = Special MK2Z = Special MK1 |
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
go back to result pageSupported by programmers and programming adapters/modules:
BeeHive204 | adapter/module: DIL32/SDIP32 ZIF 400mil (70-0187) |
BeeHive208S | adapter/module: DIL32/SDIP32 ZIF 400mil (70-0187) |
BeeProg2 | adapter/module: DIL32/SDIP32 ZIF 400mil (70-0187) |
BeeProg2C | adapter/module: DIL32/SDIP32 ZIF 400mil (70-0187) |