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Ord. no. | 70-1395 |
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Socket | ZIF BGA144 OpenTop type |
Bottom | 8x25 + 3x20 pins, square, 0.6x0.6mm |
Class | BGA |
Subclass | BGA-Top |
Availability in stock |
2 pcs.
[ other 13 pcs. within 3 working days ]
This number indicates quantity of items that could be produced from components in stock. Reasonable quantity of this product can be available within 3 working days. |
Price: US $495.00 [read this!]
Price 2-3: US $470.30
Price 4-7: US $455.40
Price 8+ : Ask for price [?]
Elnec fully understand needs of customers programming high volumes for which cost of adapters is one of most important component of costs. Therefore Elnec policy is to offer:
1. fixed discount when buying 4+ adapters of particular type,
2. individual discount for quantities 8+ according to type of adapter and demanded quantity. To get Quotation 8+ please click here:
Ask for price
We are sorry but your territory is covered by our sole distributor. Contact please the distributor for your country - listed in our web site.
Adapter manual
- For work with BGA device it is necessary put together BGA-Top-240 ZIF with some BGA-Bottom-X board according to the information provided by PG4UW software for each particular device (menu Device/ Device info).
- The top cover must be fully actuated (depressed) before inserting a package into the socket. If the chip is inserted into only partially opened ZIF socket, then - after releasing of top - the tweezer contact might bend and if more times done by this way also tweezer contact can be broken.
- Once fully actuated, drop the device into the socket from a height of 2 to 3mm above the seating plane.
- Do not push package while loading or releasing the lid.
- Do not directly touch the pins of the adapter, because dirt may cause errors during programming of device.
- Check brochure - https://www.elnec.com/sw/3m_tweezer_handling.pdf - for details on proper insertion procedure of chip/device into this ZIF socket.
- The picture show, how to put together the BGA-Top-X ZIF-CS and BGA-Bottom-X boards to have complete BGA adapter.
- Operation conditions: operating temperature 5°C ÷ 40°C (41°F ÷ 104°F), operating humidity 20%..80%, non condensing.
Software note
- If software version, you're using currently, doesn't contain support for this programming module, please download the latest version of software - Regular or OnDemand - from our web site.
Accepted package(s)
BGA package | |
NAME | SYMBOL | MIN | NOM | MAX |
Profile | A | 1.21 | - | 1.7 |
Ball Height | A1 | 0.21 | - | - |
Body Thickness | A2 | - | 1.085 | - |
Ball Diameter | b | 0.35 | 0.4 | 0.45 |
Body Size | D | 9.85 | 10 | 10.15 |
Body Size | E | 9.85 | 10 | 10.15 |
Ball Pitch | e | - | 0.8 | - |
Ball Array D | GD | - | 12 | - |
Ball Array E | GE | - | 12 | - |
NAME | SYMBOL | MIN | NOM | MAX |
Profile | A | - | - | 1.7 |
Ball Height | A1 | 0.27 | - | - |
Body Thickness | A2 | - | 1.085 | - |
Ball Diameter | b | 0.45 | 0.5 | 0.55 |
Body Size | D | 9.85 | 10 | 10.15 |
Body Size | E | 9.85 | 10 | 10.15 |
Ball Pitch | e | - | 0.8 | - |
Ball Array D | GD | - | 10 | - |
Ball Array E | GE | - | 10 | - |
NAME | SYMBOL | MIN | NOM | MAX |
Profile | A | - | - | 1.7 |
Ball Height | A1 | 0.21 | - | - |
Body Thickness | A2 | - | 1.07 | - |
Ball Diameter | b | 0.35 | 0.4 | 0.45 |
Body Size | D | 9.85 | 10 | 10.15 |
Body Size | E | 9.85 | 10 | 10.15 |
Ball Pitch | e | - | 0.8 | - |
Ball Array D | GD | - | 12 | - |
Ball Array E | GE | - | 12 | - |
NAME | SYMBOL | MIN | NOM | MAX |
Profile | A | 1.22 | 1.36 | 1.5 |
Ball Height | A1 | 0.29 | 0.34 | 0.39 |
Body Thickness | A2 | 0.93 | 1.02 | 1.11 |
Ball Diameter | b | 0.43 | 0.48 | 0.53 |
Body Size | D | 9.85 | 10 | 10.15 |
Body Size | E | 9.85 | 10 | 10.15 |
Ball Pitch | e | - | 0.8 | - |
Ball Array D | GD | - | 12 | - |
Ball Array E | GE | - | 12 | - |
NAME | SYMBOL | MIN | NOM | MAX |
Profile | A | - | - | 1.4 |
Ball Height | A1 | 0.25 | - | 0.35 |
Body Thickness | A2 | 0.82 | 0.91 | 1 |
Ball Diameter | b | 0.35 | - | 0.45 |
Body Size | D | 9.95 | 10 | 10.05 |
Body Size | E | 9.95 | 10 | 10.05 |
Ball Pitch | e | - | 0.8 | - |
Ball Array D | GD | - | 12 | - |
Ball Array E | GE | - | 12 | - |
NAME | SYMBOL | MIN | NOM | MAX |
Profile | A | 1.3 | 1.4 | 1.5 |
Ball Height | A1 | 0.31 | 0.36 | 0.41 |
Body Thickness | A2 | 0.99 | 1.04 | 1.09 |
Ball Diameter | b | 0.4 | 0.46 | 0.52 |
Body Size | D | - | 10 | - |
Body Size | E | - | 10 | - |
Ball Pitch | e | - | 0.8 | - |
Ball Array D | GD | - | 10 | - |
Ball Array E | GE | - | 10 | - |