BGA-Top-137 ZIF-CS
- top board of BGA converters
- ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball width and package thickness.
- The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
- operation life of ZIF socket - 500.000 actuations
| Ord. no | 70-0762 |
| Socket | ZIF BGA8, ClamShell type |
| Bottom | 4 rows, 4x 25 pins, square, 0.6x0.6mm |
| Class | BGA |
| Subclass | BGA-Top |
Converter manual
- For work with BGA device it is necessary put together BGA-Top-137 ZIF-CS with some BGA-Bottom-x board according to the information provided by PG4UW software.
- Do not directly touch the pins of the converter, because dirt may cause errors during programming of device.
- The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA converter
Accepted package dimensions:
NAME SYMBOL MIN NOM MAX Profile A 0.81 0.91 1 Ball Height A1 0.15 0.2 0.25 Ball Thickness A2 - - - Ball Diameter b 0.25 0.3 0.35 Body Size D - 4.07 - Body Size E - 2.47 - Ball Pitch e - 0.75 - Ball Array D GD - 4 - Ball Array E GE - 2 -
Software note
- If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.
Accepted package(s)
| BGA package |  |
 |
| NAME | SYMBOL | MIN | NOM | MAX |
| Profile | A | 0.81 | 0.91 | 1 |
| Ball Height | A1 | 0.15 | 0.2 | 0.25 |
| Body Thickness | A2 | - | - | - |
| Ball Diameter | b | 0.25 | 0.3 | 0.35 |
| Body Size | D | - | 4.07 | - |
| Body Size | E | - | 2.47 | - |
| Ball Pitch | e | - | 0.75 | - |
| Ball Array D | GD | - | 4 | - |
| Ball Array E | GE | - | 2 | - |
