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Electronica India 2010

September 7-10 2010,
BIEC Bangalore, India
hall: Hall 2
stall no.: 2654
exhibitor: Hexaa Bytes Systems


Electronica 2010

November 9-12 2010,
New Munich Trade Fair, Germany
hall: Hall A6
booth no.: Booth 146
exhibitor: Elnec s.r.o.

HOME » Products » Socket Converters » Socket Converters Info » BGA-Top-113 ZIF-CS

BGA-Top-113 ZIF-CS

BGA-Top-113 ZIF-CS
(ord.no. 70-0631)

See: Converter manual | Accepted package(s)
  • top board of BGA converters
  • ZIF socket accepts many variations of BGA packages, that differ in ball diameter, ball width and package thickness.
  • The picture at Accepted package(s) section shows the range of all dimensions of BGA packages, which are accepted by this BGA-Top board.
  • operation (mechanical) life of ZIF socket - 500.000 actuations
  • made in Slovakia
Ord. no 70-0631
Socket ZIF BGA64, ClamShell type
Bottom 4 rows, 4x 25 pins, square, 0.6x0.6mm
Class BGA/LGA
Subclass BGA-Top
Availability in stock 0
Converter manual
  • For work with BGA device it is necessary put together BGA-Top-113 ZIF-CS with some BGA-Bottom-x board according to the information provided by PG4UW software.
  • Do not directly touch the pins of the converter, because dirt may cause errors during programming of device.
  • The picture show, how to put together the BGA-Top-x ZIF-CS and BGA-Bottom-x boards to have complete BGA converter

Software note
  • If software version, you're using currently, doesn't contain support for this programming adapter, please download the latest version of software - Regular or OnDemand - from our web site.
 
Accepted package(s)
BGA package Package
Design
NAMESYMBOLMINNOMMAX
ProfileA--1
Ball HeightA10.23--
Body ThicknessA2---
Ball Diameterb-0.35-
Body SizeD9.91010.1
Body SizeE8.999.1
Ball Pitche-1-
Ball Array DGD-8-
Ball Array EGE-8-