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Device: Am27C1024

Manufacturer: AMD

Part number description for this device:

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Am AMD Products  
27XX Family Signature 27LV = Low Voltage CMOS EPROM27C = CMOS EPROM27H = High Speed CMOS EPROM
XX Density 08 = 1kx816 = 2kx832 = 4kx864 = 8kx8128 = 16kx8256 = 32kx8512 = 64kx8010 = 128kx8020 = 256kx8040 = 512kx8080 = 1Mx8100 = 128kx8191 = 2kx8291 = 2kx8400 = 256kx16 or 512kx8800 = 512kx16 or 1Mx81024 = 64kx162048 = 128kx164096 = 256kx16
XX Speed Option 150 = 150 ns200 = 200 ns250 = 250 ns300 = 300 ns
X Package Type P = Plastic DIPL = Ceramic LCCD = Ceramic DIPJ = Plastic leaded chip carrier (PLCC)
X Temperature Range C = CommercialI = Industrial
X Optional Processing Blank = Standad processingB = Burn-in

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 direct connection
BeeHive208S direct connection
BeeHive304 adapter/module: AP3 DIL48 (73-3319)
BeeProg2 direct connection
BeeProg2C direct connection
BeeProg3 adapter/module: AP3 DIL48 (73-3319)
SmartProg2 direct connection
MEMprog2 (discontinued) direct connection
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