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Device: AFS250 [FBGA256](STP)

Manufacturer: Actel

Part number description for this device:

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XXXXX Device Family AFS = Fusion devicesM7AFS = Fusion devices with ARM7M1AFS = Fusion devices with Cortex-M1A3P = ProASIC3 devicesM7A3P = ProASIC3 devices with ARM7M1A3P = ProASIC3 devices with Cortex-M1AGL = IGLOO devicesM1AGL = IGLOO devices with Cortex-M1A3PE = ProASIC3E devicesAGLE = IGLOO devicesM1AGLE = IGLOO devices with Cortex-M1AGLN = IGLOO nano devicesAGLP = IGLOO PLUS devicesA3PN = ProASIC3 nano devicesM1A3PE = ProASIC3E devices with Cortex-M1M7A3PE = ProASIC3E devices with ARM7P1AFS = Pigeon Point Fusion devicesU1AFS = MicroBlade Fusion devices
XXXX System Gates Count 010 = 10000 system gates015 = 15000 system gates030 = 30000 system gates060 = 60000 system gates090 = 90000 system gates125 = 125000 system gates250 = 250000 system gates400 = 400000 system gates600 = 600000 system gates1000 = 1000000 system gates1500 = 1500000 system gates3000 = 3000000 system gates
X Power Blank = StandardL = Low-power
XX Supply Voltage BlankV2 = 1.2V to 1.5VV5 = 1.5V
X Enhanced Features Blank = StandardZ = Devices without enhanced features
X Speed Grade Blank = StandardF = 20\\\\% slower than standard1 = 15\\% faster than standard2 = 25\% faster than standard
XX Package Type QN = Quad flat no lead (0.5mm pitch)PQ = Plastic quad flat pack (0.5mm pitch)FG = Fine pitch ball grid array (1.0mm pitch)VQ = Very thin quad flat pack (0.5mm pitch)TQ = Thin quad flat pack (0.5mm pitch)UC = Micro chip scale package (0.4mm pitch)CS = Chip scale package (0.5mm pitch)
X Lead-free Packaging Options Blank = Standard packagingG = RoHS-compliant (green) packaging
XXX Package Lead Count  
X Application (Ambient Temperature Range) Blank = Commercial (0°C to 70°C)I = Industrial (-40°C to 85°C)PP = Pre-productionES = Engineering silicon (room temperature only)

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-1080/1079A (70-1080/1079A) = BGA-Bottom-103 (70-1080) + BGA-Top-208 ZIF (a) (70-1079A)
BeeHive204AP adapter/module: AP1 BGA-1080/1079 (71-2031)
BeeHive208S adapter/module: BGA-1080/1079A (70-1080/1079A) = BGA-Bottom-103 (70-1080) + BGA-Top-208 ZIF (a) (70-1079A)
BeeHive304 adapter/module: AP3 BGA256-3 PLD-18 (73-3854)
BeeProg2 adapter/module: BGA-1080/1079A (70-1080/1079A) = BGA-Bottom-103 (70-1080) + BGA-Top-208 ZIF (a) (70-1079A)
BeeProg2AP adapter/module: AP1 BGA-1080/1079 (71-2031)
BeeProg2C adapter/module: BGA-1080/1079A (70-1080/1079A) = BGA-Bottom-103 (70-1080) + BGA-Top-208 ZIF (a) (70-1079A)
BeeProg3 adapter/module: AP3 BGA256-3 PLD-18 (73-3854)
BeeHive204AP-AU (discontinued) adapter/module: AP1 BGA-1080/1079 (71-2031)
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