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Device: AS29F040DCG

Manufacturer: Austin Semic. Inc.

Part number description for this device:

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AS Austin Semiconductor  
XXX Family Signature 28F = FLASH memory8F = FLASH memory8E = EEPROM memory
XXXXX Density 010 = 128kx8512k32 = 512kx32, 1Mx16, 2Mx8512k8 = 512kx8040 = 512kx8
XXX Package Type ECA = Ceramic LCCF = Ceramic Flat PackSF = Radiation shielded ceramic FPCW = 600mil DIPDCJ = Ceramic SOJDG = Plastic SOPQ = Ceramic QFPP = PGADCG = 32-pin Lead formed Flatpack
XX Speed Option 55 = 55 ns60 = 60 ns70 = 70 ns90 = 90 ns12, 120 = 120 ns15, 150 = 150 ns17 = 170 ns20 = 200 ns25 = 250 ns30 = 300 ns
/    
XX Operating Temperature XT = militaryIT = industrial883C = Full Military ProcessingQ = QML Processing

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL44/SOIC44 ZIF-CS (70-0043)
BeeHive208S adapter/module: DIL44/SOIC44 ZIF-CS (70-0043)
BeeProg2 adapter/module: DIL44/SOIC44 ZIF-CS (70-0043)
BeeProg2C adapter/module: DIL44/SOIC44 ZIF-CS (70-0043)
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