B = eSHE – on, HSM – off, RSA - 2KC = eSHE – on, HSM – on, RSA - 2K
X
Marketing Option
A = No optionsE = Ethernet - 1 ch, eMMC - on
X
Revision
A = First revisionB = Second revisionC = Third revisionD = Fourth revision
X
Fab Location
Q = UMC (Fab12i) Singapore
X
Reserved
0Reserved
X
Package Code
AZ = LQFPAE = TEQFPBZ = BGA
X
Temperature Grade
A = A-grade (–40°C to 85°C)E = E-grade (–40°C to 125°C)S = S-grade (–40°C to 105°C)
X
Quality Grade
ES = Engineering samplesGS = Standard grade of automotive
X
Shipment Type
Blank = Tray shipmentT = Tape and Reel ship
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
