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Device: PALC16R6L [LCC20]

Manufacturer: Cypress

Part number description for this device:

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XXXXX Device Type PALC = CMOS PALPALCE = Erasable CMOS PALPLDC = CMOS PLDCY = Erasable programmable logic deviceCG = CMOS PLD with JEDEC PLCC pinout
XXXXXX Device Number e.g. 16R8 = PAL 2022V10 = PAL 24 variable product terms16V8 = Flash-erasable PAL 2020G10 = Generic PLD 247C335 = Universal synchronous EPLD7C3741B = MAX 340 erasable CPLD7C3741 = Flash-erasable CPLD20RA10 = Asynchronous outputs7C324 = Asynchronous outputs with JEDEC pinout
XX Speed Option - in ns or MHz
X Package Type A = Thin quad plastic flatpack (TQFP)B = Plastic pin grid array (PPGA)D = Ceramic dual in-line package/Brazed DIPE = Tape automated bonding (TAB)F = Flatpack (solder-sealed flat package)G = Pin grid array (PGA)H = Windowed leaded chip carrierJ = Plastic leaded chip carrier (PLCC)K = Cerpack (Glass-sealed flat package)L = Leadless chiop carrrier (LCC)N = Plastic quad flatpack (PQFP)P = Plastic dual in-line (PDIP)Q = Windowed leadless chip carrier (LCC)Q = Quarter size outline package (for PALCE16V8 and PALCE20V8 only)R = Windowed pin grid array (PGA)S = SOIC (gull wing)T = Windowed cerpackU = Ceramic quad flatpack (CQFP)V = SOIC (J lead)W = Windowed ceramic dual in-line package (CerDIP)X = DICE (waffle pack)Y = Ceramic leaded chip carrierBB = Fine pitch ball grid array (FBGA)BG = Ball grid arrayNT = Thermally enhanced plastic quad flat pack (EQFP)MB = Self boot – Fine pitch ball grid array (FBGA)MG = Self boot – Ball grid array (BGA)
X Temperature Range C = CommercialI = IndustrialM = Military
X Processing Blank = Level 2 processing for commercial productB = MIL-STD-883C for military productT = Surface-mounted devices to be tape and reeledR = Level 2 processing on tape and reeled devices

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL20/PLCC20 ZIF-CS (70-0329)
BeeHive208S adapter/module: DIL20/PLCC20 ZIF-CS (70-0329)
BeeProg2 adapter/module: DIL20/PLCC20 ZIF-CS (70-0329)
BeeProg2C adapter/module: DIL20/PLCC20 ZIF-CS (70-0329)
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