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Device: DSND4G08S3C [FBGA63]

Manufacturer: Dosilicon

Part number description for this device:

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DS Dosilicon Memory  
XX Product Family ND = NAND flash
XX Density 28 = 128Mbit56 = 256Mbit12 = 512Mbit1G = 1Gbit2G = 2Gbit4G = 4Gbit8G = 8Gbit6G = 16Gbit
XX Organization 08 = x816 = x16
X Operation Voltage U = 3.3VL = 2.5VS = 1.8V
X Classification 1 = SLC S/B2 = MLC S/B3 = SLC L/B4 = MLC L/B
X Generation N,M
X Temperature Range C = Commercial (0°C to 70°C)E = Extended (-25°C to 85°C)I = Industrial (-40°C to 85°C)
XX Package Type 0Bare dieW = KGDA = 12x20mm (TSOP48), H-ROHS & Halogen freeB = 12x17mm (ULGA52), H-ROHS & Halogen freeC = 9x9mm (FBGA48), H-ROHS & Halogen freeD = 9x11mm (FBGA63), H-ROHS & Halogen freeF = 6.5x8mm (FBGA67), H-ROHS & Halogen free

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL48/BGA63-1 ZIF NAND-1 (70-3105)
BeeHive204AP adapter/module: AP1 BGA63-1 ZIF NAND-1 (71-3669)
BeeHive208S adapter/module: DIL48/BGA63-1 ZIF NAND-1 (70-3105)
BeeHive304 adapter/module: AP3 BGA63-1.12 NAND-1 (73-3166) OR AP3 BGA63-1.13 CS NAND-1 (73-4250)
BeeProg2 adapter/module: DIL48/BGA63-1 ZIF NAND-1 (70-3105)
BeeProg2AP adapter/module: AP1 BGA63-1 ZIF NAND-1 (71-3669)
BeeProg2C adapter/module: DIL48/BGA63-1 ZIF NAND-1 (70-3105)
BeeProg3 adapter/module: AP3 BGA63-1.12 NAND-1 (73-3166) OR AP3 BGA63-1.13 CS NAND-1 (73-4250)
BeeHive204AP-AU (discontinued) adapter/module: AP1 BGA63-1 ZIF NAND-1 (71-3669)
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