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Device: H27U1G8F2C [TSOP48] (JQR-01)

Manufacturer: Hynix

Part number description for this device:

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H Hynix  
X Product Family 2 = Flash
X Product Mode 7 = NAND Flash
X Power Supply U = 2.7V to 3.6VL = 2.7VS = 1.8V
XX Density 64 = 64Mb12 = 128Mb25 = 256Mb51 = 512Mb1G = 1Gb2G = 2Gb4G = 4Gb8G = 8GbAG = 16GbBG = 32GbCG = 64GbDG = 128Gb
X Organization 8 = x816 = x16
X NAND Classification S = SLC + Single die + Small blockA = SLC + Double die + Small blockB = SLC + Quadrupple die + Small blockF = SLC + Single die + Large blockG = SLC + Double die + Large blockH = SLC + Quadruple die + Large blockK = SLC + DSP + Large blockT = MLC + Single die + Large blockU = MLC + Double die + Large blockV = MLC + Quadruple die + Large blockW = MLC + DSP + Large block
X Function Mode 1 = 1nCE & 1R/nB, Sequential row read enable2 = 1nCE & 1R/nB, Sequential row read disable4 = 2nCE & 2R/nB, Sequential row read enable5 = 2nCE & 2R/nB, Sequential row read disableD = Dual interface, Sequential row read disableF = 4nCE & 4R/nB, Sequential row read disable
X Die Generation M = 1st generationA = 2nd generationB = 3rd generationC = 4th generation
X Package Type T = TSOP1V = WSOPS = USOPW = WaferD = PGD2Y = TLGAU = ULGAF = FBGAC = PGD1 (chip)K = KGD
X Package Material A = WaferP = Lead freeL = LeadedR = Lead & Halogen free
X Bad Block B = Included bad blockS = 1~5 bad block includedP = All good block
X Operation Temperature C = Commercial (0°C to 70°C)E = Extended (-25°C to 85°C)M = Mobile (-30°C to 85°C)I = Industrial (-40°C to 85°C)

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
BeeHive204AP adapter/module: AP1 TSOP48 ZIF 18.4mm NAND-3 (71-3097) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
BeeHive208S adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
BeeProg2 adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
BeeProg2AP adapter/module: AP1 TSOP48 ZIF 18.4mm NAND-3 (71-3097) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
BeeProg2C adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
BeeHive204AP-AU (discontinued) adapter/module: AP1 TSOP48 ZIF 18.4mm NAND-3 (71-3097) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
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