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Device: HY29DL163BF [FBGA48]

Manufacturer: Hynix

Part number description for this device:

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HY Hynix  
XX Family Descriptor 29 = FLASH
XX Technology LV = Low VoltageDS = Super-Low VoltageDL = 3V FlashF = 5V Flash
XXX Density 16x = 2Mx8 / 1Mx16322,323 = 4Mx8 / 2Mx16002 = 256kx16040, 040A = 512kx8400, 400A = 512kx8 / 256x16800 = 1Mx8 / 512kx16
X Boot Block Location B = Bottom boot block optionT = Top boot block option
X Package Type F = FBGAP = Plastic DIPC = PLCCT = TSOPR = Reverse TSOPG = PSOP
X Speed Option 45 = 45 ns70 = 70 ns80 = 80 ns90 = 90 ns12 = 120 ns
X Temperature Range Blank = CommercialI = IndustrialE = Extended
X Special Instructions  

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-0245/0612 (70-0245/0612) = BGA-Bottom-1 (70-0245) + BGA-Top-110 ZIF-CS (70-0612)
BeeHive208S adapter/module: BGA-0245/0612 (70-0245/0612) = BGA-Bottom-1 (70-0245) + BGA-Top-110 ZIF-CS (70-0612)
BeeProg2 adapter/module: BGA-0245/0612 (70-0245/0612) = BGA-Bottom-1 (70-0245) + BGA-Top-110 ZIF-CS (70-0612)
BeeProg2C adapter/module: BGA-0245/0612 (70-0245/0612) = BGA-Bottom-1 (70-0245) + BGA-Top-110 ZIF-CS (70-0612)
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