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Device: JW640 [VFBGA130]

Manufacturer: Micron

Part number description for this device:

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MT Micron Technology  
XXX Product Family 27C = OneNAND + LPDRAM MCP/PoP28C = NOR + LPDRAM MCP/PoP29C = NAND flash + LPDRAM MCP/PoP
XX NAND Flash Density DM = 128MbitEM = 256MbitFM = 512Mbit1G = 1Gbit2G = 2Gbit4G = 4Gbit8G = 8GbitAG = 16GbitBG = 32GbitCG = 64GbitDG = 128Gbit
XXX LPDRAM Density 56M = 256Mbit12M = 512Mbit40M = 640Mbit24M = 1Gbit52M = 1152Mbit48M = 2Gbit72M = 3Gbit96M = 4Gbit92M = 8Gbit
X Operating Voltage Range A = 1.70V to 1.95VB = 1.65V to 1.90VC = 1.50V to 1.70VD = 1.20V to 1.50VF = 1.00V to 1.20VG = 1.70 – 1.95V DRAM; 2.70 – 3.60V NOR Vcc; 1.65 – 3.60V Vccq
X NAND Flash Configuration A = x8, M28AB = x16, M28AC = x8, M48AD = x16, M48AE = x8, L58AF = x16, L58AG = x8, M49AH = x16, M49AJ = x8, M59AK = x16, M59AL = x8, L59AM = x16, L59AN = x8, M50AP = x16, M50AR = x8, L51AT = x16, L51AU = x8, M58AV = x16, M58AY = x8 M60AZ = x16, M60AAA = x8, M69AAB = x16, M69AAC = x8, M68AAD = x16, M68AAE = x8, M71MAF = x16, M71MAG = x8, M70MAH = x16, M70MAI = x8, M68MAJ = x8, M68MAL = x16, M61NAH = x16 QKHPAM = x16, M69NAK = x16, 3F0S
X LPDRAM Configuration A = DDR, T37M x16B = SDR, Y37M x16C = DDR, T37M x32D = SDR, Y37M x32J = DDR, T48M x16K = SDR, Y48M x16L = DDR, T48M x32M = SDR, Y48M x32N = DDR, T47M x16P = SDR, Y47M x16R = DDR, T47M x32T = SDR, Y47M x32V = DDR, T67M x16Y = DDR, T67M x32Z = SDR, Y36N x16AA = DDR, T36N x16AB = DDR, T35M x32AC = SDR, Y35M x32AE = SDR, Y67M x16AF = SDR, Y67M, x32AG = SDR, Y67M x16 + Y35M x16AH = DDR, T68M x16AJ = SDR, Y68M x16AK = DDR, T68M x32AL = SDR, Y68M x32AM = DDR, T69M x16AN = SDR, Y69M x16AP = DDR, T69M x32AR = SDR, Y69M x32AS = SDR, Y47M x16(2) + Y35M x16AT = DDR, T48M x16(2) + T48M x32AU = DDR, T36N x32AV = DDR, T36N x32AY = DDR, T69M x32 + T68M x32AZ = DDR, T79M x16BA = DDR, T79M x32BB = DDR, T89M x32
X Chip Count A = 1 NAND, 1 LPDRAM (1xCE#, 1xCS#)B = 2 NAND, 1 LPDRAM (2xCE#, 1xCS#)C = 1 NAND, 2 LPDRAM (1xCE# 2xCS#)D = 2 NAND, 2 LPDRAM (2xCE#, 2xCS#)E = 1 NAND, 3 LPDRAM (1xCE#, 2xCS#)F = 2 NAND, 3 LPDRAM (1xCE#, 2xCS#)G = 1 NAND, 4 LPDRAM (1xCE#, 2xCS#)H = 1 NAND, 3 LPDRAM (1xCE#, 3xCS#)
XX Package Code CA = 152-ball PoP VFBGA (14.0x14.0x0.9mm)CG = 152-ball PoP VFBGA (14.0x14.0x1.0mm)HC = 149-ball TFBGA (16.5x10.5x1.2mm)JA = 137-ball TFBGA (13.0x10.5x1.2mm)JC = 107-ball TFBGA (13.0x10.2x1.2mm)JG = 168-ball PoP VFBGA (12.0x12.0x0.9mm)JI = 168-ball PoP TFBGA (12.0x12.0x1.1mm)JQ = 152-ball PoP TFBGA (14.0x14.0x1.1mm)JR = 137-ball LFBGA (13x10.5x1.4mm)JS = 137-ball TFBGA (13x10.5x1.4mm)JV = 168-ball PoP VFBGA (12.0x12.0x1.0mm)KC = 107-ball TFBGA (13x10.5x1.1mm)KD = 137-ball TFBGA (13.0x10.5x1.1 mm)KN = 184-ball PoP VFBGA (14.0x14.0x1.0mm)KQ = 168-ball PoP WFBGA (12.0x12.0x0.75mm)KS = 137-ball VFBGA (13.0x10.5x1.0mm)MA = 168-ball PoP WFBGA (12.0x12.0x0.7mm)MC = 240-ball PoP WFBGA (14.0x14.0x0.8mm)MD = 130-ball VFBGA (9.0x8.0x1.0mm)ME = 240-ball PoP TFBGA (14.0x14.0x1.12mm)MF = 168-ball PoP VFBGA (12.0x12.0x0.85mm)MJ = 240-ball PoP VFBGA (14.0x14.0x0.85mm)MK = 153-ball VFBGA (12.0x10.0x0.9mm)ML = 153-ball VFBGA (9.0x8.0x0.9mm)MS = 191-ball PoP WFBGA (12.0x12.0x0.8mm)NE = 133-ball VFBGA (11.0x10.0x1.0mm)RN = 160-ball FBGA (11.5x11.5x0.94mm)TE = 153-ball VFBGA (12.0x10.0x1.0mm)PL = 162-ball WFBGA (13.0x11.5x0.8mm)SK = 162-ball VFBGA (13.0x11.5x0.9mm)SP = 192-ball WFBGA (10.5x8.0x0.8mm)
X LPDRAM Access Time 5 = 200MHz, CL354 = 185MHz, CL36 = 166MHz, CL375 = 133MHz, CL38 = 125MHz, CL310 = 100MHz48 = 208MHz
X Special Options Blank = StandardL = Low-power optionE = On-die ECC enabled
XX Operating Temperature Range IT = Industrial (-40°C to 85°C)W = Wireless (-25°C to 85°C)
XX Production Status Blank = ProductionES = Engineering sampleMS = Mechanical sampleQS = Qualification sampleDC = Daisy chain

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL48/BGA130-1 ZIF NAND-1 (70-3176)
BeeHive208S adapter/module: DIL48/BGA130-1 ZIF NAND-1 (70-3176)
BeeProg2 adapter/module: DIL48/BGA130-1 ZIF NAND-1 (70-3176)
BeeProg2C adapter/module: DIL48/BGA130-1 ZIF NAND-1 (70-3176)
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