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Device: JY323 [FBGA153]

Manufacturer: Micron

Part number description for this device:

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MT Micron Technology  
XX Product Family FC = NAND flash + controller
XX NAND Flash Density 1G = 1GB2G = 2GB4G = 4GB8G = 8GB16G = 16GB32G = 32GB64G = 64GB
X NAND Flash Component C = Configuration: MLC 8Gbx8, 3.3V / Generation: AD = Configuration: MLC 8Gbx8, 3.3V / Generation: BE = Configuration: MLC 16Gbx8, 3.3V / Generation: AG = Configuration: MLC 16Gbx8, 3.3V / Generation: AK = Configuration: MLC 32Gbx8, 3.3V / Generation: BM = MLC 16Gb, x8, 3.3V (25nm)L = MLC 32Gb, x8, 3.3V (25nm)J = MLC 64Gb, x8, 3.3V (25nm)
X Controller Revision F = 6K = 11L = 12QTV
X   - reserved blank
XX Package Codes DI = 169-ball TFBGA 12x16x1.2mmDK = 169-ball LFBGA 12x16x1.4mmDQ = 100-ball LBGA 14x18x1.4mmDM = 153-ball FBGA, 11.5mm x 13mm x 1.2mmDN = 169-ball FBGA, 14mm x 18mm x 1.4mmDL = 169-ball FBGA, 12mm x 18mm x 1.2mmEA = 153 WFBGA 11.5mm x 13mm x 0.8mmEC = 169 WFBGA 14mm x 18mm x 0.8mmED = 169 VFBGA 14mm x 18mm x 1.0mm
XX Operating Temperature Range Blank = 0°C to 70°CWT = Standard (-30°C to 85°C)IT = Industrial (–40°C to +85°C)
XX Production Status Blank = ProductionES = Engineering sampleQS = Qualification sampleMS = Mechanical sample
:    
X Design Revision Blank = N/AA = Design revision A

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-165 (70-1009) + BGA-Top-284 ZIF (a) (70-2635A) or BGA-Bottom-327 (70-3110) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-327 (70-3110) + BGA-Top-284 ZIF (a) (70-2635A) or DIL48/BGA153-1.01 ZIF eMMC-3 (70-6331)
BeeHive204AP adapter/module: AP1 BGA153-1.01 eMMC-1 (71-3322)
BeeHive208S adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-165 (70-1009) + BGA-Top-284 ZIF (a) (70-2635A) or BGA-Bottom-327 (70-3110) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-327 (70-3110) + BGA-Top-284 ZIF (a) (70-2635A) or DIL48/BGA153-1.01 ZIF eMMC-3 (70-6331)
BeeHive304 adapter/module: AP3 BGA153-1.01 eMMC-1 (73-3040)
BeeProg2 adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-165 (70-1009) + BGA-Top-284 ZIF (a) (70-2635A) or BGA-Bottom-327 (70-3110) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-327 (70-3110) + BGA-Top-284 ZIF (a) (70-2635A) or DIL48/BGA153-1.01 ZIF eMMC-3 (70-6331)
BeeProg2AP adapter/module: AP1 BGA153-1.01 eMMC-1 (71-3322)
BeeProg2C adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-165 (70-1009) + BGA-Top-284 ZIF (a) (70-2635A) or BGA-Bottom-327 (70-3110) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-327 (70-3110) + BGA-Top-284 ZIF (a) (70-2635A) or DIL48/BGA153-1.01 ZIF eMMC-3 (70-6331)
BeeProg3 adapter/module: AP3 BGA153-1.01 eMMC-1 (73-3040)
BeeHive204AP-AU (discontinued) adapter/module: AP1 BGA153-1.01 eMMC-1 (71-3322)
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