A = A - revisionB = B - revisionJ = J - revisionL = L - revision
XX
Package Type
CZ = DIPF1 = Plastic BGA (Wire bonding)F5 = Plastic BGA (Flip chip)F9 = Tape BGA (Wire bonding)G5 = TSOP II (10.16 mm width)GF = LQFP (14x20 mm width)GU = TSOP I (11.43 mm width)GW = SOP, TSOP I (13.4 mm width)GX = SOP (15.24 mm width)GY = TSOP I (18.0 mm width)GZ = TSOP I (20.0 mm width)LE = SOJ (10.16 mm width)
X
Power Supply
Blank = 5.0 VA = 3.3 VB = 3.0 VC = 2.5 VE = 1.8V
XX
Speed Grade
12 = 120 ns15 = 150 ns
X
Protection Block
B = Bottom addressT = Top address
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
