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X
Qualification Status
M = Fully spec. qualified, general market flowS = Fully spec. qualified, automotive flowP = Pre-qualification
XX
Power Architecture Core
PC
XXXXX
Device Number
5643L
X
Blank = No FlexRayF = FlexRay
XX
Fab and Mask Indicator
F = ATMC FabO = Version of the masketA = Mask set indicator (Blank=1st production maskset, A=2nd, B=3rd, etc.)
X
Temperature Specification
M = -40°C to 125°CV = -40°C to 105°C
XX
Package Code
LQ = 144 LQFPMM = 257 MAPBGA
X
Operating Frequency
1 = 120MHz8 = 80MHz
X
Packing
Blank = TrayR = Tape & Reel
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
