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Device: K8P3215UQB [FBGA64]

Manufacturer: Samsung

Part number description for this device:

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K Memory  
8 NOR Flash  
X Small Classification 5 = Dual bank die stack6 = Single bank die stack7 = Multiplexed DDP8 = De-Multiplexed DDPA = De-Multiplexed burstB = Single bank boot blockC = MLC De-MuxedD = Dual bank boot blockF = MLC muxedG = MLC de-multiplexed DDPH = MLC multiplexed DDPL = Intel NOR flashP = Page modeS = Multiplexed burstT = Mitsubishi NOR flashU = Single bank uniform block
XX Density - Dual bank die stack64 = 64M (3232,824)65 = 64M (3232,1616)- Single bank die stack27 = 128M(2CS)64 = 64M(32M,32M)55 = 256Mbit(16Mx16)- Multiplexed DDP11 = 512M(1CS, 32Bank)13 = 512M(2CS)56 = 256M(16Bank)1G = 1G(16Bank)- De-Multiplexed DDP12 = 512M(16Bank)13 = 512M(2CS)56 = 256M(16Bank)1G = 1G(16Bank)- De-Multiplexed Burst12 = 512M(16Bank)28 = 128M(8M,16Bank)32 = 32M(2M, 16Bank)56 = 256M(16Bank)64 = 64M(4M, 16Bank)- Single Bank Boot Block16 = 16M27 = 128M(2CS)28 = 128M32 = 32M64 = 64M80 = 8M- MLC De-Muxed12 = 512M(16Bank)56 = 256M(16Bank)1G = 1G(16Bank)- Dual Bank Boot Block(Bank1, Bank2)15 = 16M(2M, 14M)16 = 16M(4M, 12M)17 = 16M(8M, 8M)32 = 32M(8M, 24M)33 = 32M(16M, 16M)62 = 64M(8M, 24M)63 = 64M(16M, 48M)64 = 64M(24M, 40M)65 = 64M(32M, 32M)- MLC Muxed12 = 512M(16Bank)56 = 256M(16Bank)1G = 1G(16Bank)MLC De-Multiplexed DDP11 = 512M(1CS, 32Bank)13 = 512M(2CS)- MLC Multiplexed DDP11 = 512M(1CS, 32Bank)13 = 512M(2CS)- Intel NOR Flash56 = 256M(8Bank)28 = 128M(16Bank)- Page Mode28 = 128M(8M, 16Bank)56 = 256M(16Bank)64 = 64M(4M, 16Bank)- Multiplexed Burst12 = 512M(16Bank)28 = 128M(8M, 16Bank)32 = 32M(16Bank)56 = 256M(16Bank)64 = 64M(4M, 16Bank)- Mitsubishi NOR Flash64 = 64M(4,4,28,28)- Single Bank Uniform Block16 = 16M27 = 128M(2CS)28 = 128M32 = 32M64 = 64M80 = 8M
XX Organization 08 = x815 = x1616 = x8/x1632 = x16/x32
X Power Supply 8 = 1.8V (1.7V to 1.9V)E = 1.8V (1.7V to 1.95V)F = 1.8V / Vio=3.0V (2.2V to 3.3V)K = 2.8V (2.5V to 3.1V)L = 1.8V (1.65V to 1.95V)R = 2.0V (1.8V to 2.2V)S = 2.5V (2.3V to 2.7V)U = 3.0V / 3.3V (2.7V to 3.6V)Y = 3.0V (2.7V to 3.3V)V = 3.0V (2.7V to 3.1V)
X Device Type 1 = 4MSRAM MCP2 = 8M SRAM MCP3 = 16M SRAM MCP4 = 128M SDR H-die MCP5 = 16M UtRAM MCP6 = 32M UtRAM MCP7 = 128M DDR MCP8 = OneNAND, SDRAM MCP9 = 128M MDDA = 8M Boot block MCP(Top)B = Bottom boot blockC = BootBlock(chip1-bottom, chip2-top)D = 16M Boot block MCP(Top)E = 16M Boot block MCP(Bottom)F = 16M Dual bank MCP(Top)G = 16M Dual bank MCP(Bottom)H = 32M Dual bank MCP(Top)I = 32M Dual bank MCP(Bottom)J = 64M Dual bank MCP(Top)K = 64M Dual bank MCP(Bottom)L = 4M Boot block MCP(Top)M = Top boot block in DDPN = Bottom boot block in DDPP = 256M DDR MCPQ = Top and bottom boot blockS = Uniq IDT = Top boot blockZ = Uniform block
X Generation M = 1st generationA = 2nd generationB = 3rd generationC = 4th generationD = 5th generationE = 6th generationF = 7th generationL = Intel 1st generationT = Mitsubishi 1st generation
X Package Type 1 = MCPC = Chip BIZW = WaferD = FBGA(LF)E = FBGA (LF, 1mm pitch)F = FBGAL = TBGA(LF)T = TBGAP = TSOP1(LF)S = FBGA(LF, OSP)U = FBGA(OSP)Y = TSOP1
X Temperature Range 0NoneC = CommercialE = ExtendedI = Industrial
XX Speed 03 = 85ns07 = 70ns08 = 80ns09 = 90ns12 = 120ns1A = 100ns(C/F 40MHz)1B = 100ns(C/F 54MHz)1C = 100ns(C/F 66MHz)1D = 100ns(C/F 83MHz)1E = 100ns(C/F 108MHz)1F = 100ns(C/F 133MHz)2A = 70ns/20ns(Page)2B = 80ns/25ns(Page)2C = 90ns/30ns(Page)2D = 85ns/25ns(Page)4A = 55ns/20ns(Page)4B = 60ns/25ns(Page)4C = 65ns/25ns(Page)4D = 70ns/30ns(Page)6F = 66ns(C/F 133MHz)7A = 70ns(C/F 75MHz)7B = 88.5ns(C/F 54MHz)7C = 70ns(C/F 66MHz)7D = 70ns(C/F 80MHz)7E = 70ns(C/F 40MHz)9A = 90ns(C/F 40MHz)9B = 95ns(C/F 66MHz)9C = 90ns(C/F 54MHz)9D = 90ns(C/F 80MHz)DS = Daisychain sample00 = None(containing exception handling code)

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-0245/0724 (70-0245/0724) = BGA-Bottom-1 (70-0245) + BGA-Top-132 ZIF-CS (70-0724)
BeeHive208S adapter/module: BGA-0245/0724 (70-0245/0724) = BGA-Bottom-1 (70-0245) + BGA-Top-132 ZIF-CS (70-0724)
BeeProg2 adapter/module: BGA-0245/0724 (70-0245/0724) = BGA-Bottom-1 (70-0245) + BGA-Top-132 ZIF-CS (70-0724)
BeeProg2C adapter/module: BGA-0245/0724 (70-0245/0724) = BGA-Bottom-1 (70-0245) + BGA-Top-132 ZIF-CS (70-0724)
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