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Device: KMAFG0000A-S998 [FBGA153]

Manufacturer: Samsung

Part number description for this device:

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K Memory  
M MOVI NAND/MCP  
X Small Classification A = NAND+MCUB = NAND+NAND+MCUC = NAND+NAND+NAND+NAND+MCUD = NAND+NAND+NAND+MCUH = NAND+NAND+NAND+NAND+NAND+NAND+NAND+NAND+MCUX = moviNAND+NAND+SDRAMY = moviNAND+OneNAND+SDRAMZ = moviNAND+NAND+SDRAM+SDRAM
X moviNAND Density/NAND Density/Cell/Vcc/Vccq/Organization 0NoneA = 512MByte / 2G*2 / SLC / 2.7V to 3.6V / 2.7V to 3.6V / x8B = 1GByte / 2G*4 / SLC / 2.7V to 3.6V / 2.7V to 3.6V / x8C = 2GByte / 4G*4 / SLC / 2.7V to 3.6V / 2.7V to 3.6V / x8D = 2GByte / 8G*2 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8E = 4GByte / 8G*4 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8F = 1GByte / 8G*1 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8G = 1GByte / 4G*2 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8H = 3GByte / 8G*3 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8I = 512MByte / 4G*1 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8J = 8GByte / 8G*8 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8K = 2GByte / 16G*1 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8L = 4GByte / 16G*2 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8M = 8GByte / 16G*4 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8N = 12GByte / 16G*6 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8O = 16GByte / 16G*8 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8P = 256MByte / 2G*1 / MLC / 2.7V to 3.6V / 2.7V to 3.6V / x8Q = 128MByte / 1G*1 / SLC / 2.7V to 3.6V / 2.7V to 3.6V / x8
X LSI A = S3C49RAX01D = S3C49NBX01E = S3C49VCX01F = S3C49VCX02G = S3C49VCX03N = S3C49VAX02
X NOR Flash Density/Vcc/Vccq/Organization/Type/Option 0None
X NAND/OneNAND Density/Vcc/Vccq/Organizaton/Option 0NoneA = 2G / 1.8V / 1.8V / x8 / SLCB = 1G OneNAND / 1.8V / 1.8V / x16 / MuxedC = 1G OneNAND / 1.8V / 1.8V / x16D = 2G NAND_0 / 1.8V / 1.8V / x8E = 512M / 2.7V / 2.7V / x8F = 2G NAND_0 / 1.8V / 1.8V / x16 / SLC
X UtRAM/SRAM Density/Vcc/Vccq/Organization/Option 0None
X DRAM I/F /Density/Vcc/Vccq/Organization/Option 0NoneA = MDDR*2 / 1G+512M / 1.8V / 1.8V / x32B = MDDR*2 / 512Mx2 / 1.8V / 1.8V / x32C = MDDR / 1G / 1.8V / 1.8V / x32D = MDDR*2 / 1G*2 / 1.8V / 1.8V / x32E = SDR / 256M / 1.8V / 1.8V / x32F = MDDR / 1G / 1.8V / 1.8V / x16
X Generation M = 1st generationA = 2nd generationB = 3rd generationC = 4th generation
X Package Type A = FBGA (Hallogen-free, Lead-free)B = FBGA (Halogen-free, OSP lead-free)D = FBGA (Lead-free)E = LGA (No ball)F = FBGAH = LGA (Lead-free)P = FBGA (OSP)Q = TSOP (Lead-free)S = FBGA (MoviNAND special 2)Z = FBGA (MoviNAND special 1)
X Chip Qty 1 = 1 chip2 = 2 chip3 = 3 chip4 = 4 chip5 = 5 chip6 = 6 chip
XXX Serial Number 300 = 19ns, 12ns, 7.5ns301 = 19ns, 42ns, 7.5ns302 = 19ns, 12ns, 6ns400 = 19ns(2), 42ns, 7.5ns401 = 19ns, 42ns, 6ns, 6ns402 = 19ns(2), 42ns, 6ns403 = 19ns(2), 12ns, 6ns500 = 19ns(2), 42ns, 6ns, 6ns501 = 19ns(2), 42ns, 7ns, 6ns600 = 19ns(4), 42ns, 7.5ns601 = 19ns(4), 42ns, 6ns700 = 19ns, 42ns, 7.5ns, 7.5ns701 = 19ns(4), 42ns, 6ns, 6ns998 = moviNAND normal999 = Daisychain sample
X Packing Type T = Tape&Reel0Other (Tray, Tube, Jar)S = StackP = Module Tape&ReelM = Module other packing
XX Customer (Customer List Reference)  

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-165 (70-1009) + BGA-Top-284 ZIF (a) (70-2635A) or BGA-Bottom-327 (70-3110) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-327 (70-3110) + BGA-Top-284 ZIF (a) (70-2635A) or DIL48/BGA153-1.01 ZIF eMMC-3 (70-6331)
BeeHive208S adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-165 (70-1009) + BGA-Top-284 ZIF (a) (70-2635A) or BGA-Bottom-327 (70-3110) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-327 (70-3110) + BGA-Top-284 ZIF (a) (70-2635A) or DIL48/BGA153-1.01 ZIF eMMC-3 (70-6331)
BeeHive304 adapter/module: AP3 BGA153-1.01 eMMC-1 (73-3040)
BeeProg2 adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-165 (70-1009) + BGA-Top-284 ZIF (a) (70-2635A) or BGA-Bottom-327 (70-3110) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-327 (70-3110) + BGA-Top-284 ZIF (a) (70-2635A) or DIL48/BGA153-1.01 ZIF eMMC-3 (70-6331)
BeeProg2C adapter/module: BGA-Bottom-165 (70-1009) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-165 (70-1009) + BGA-Top-284 ZIF (a) (70-2635A) or BGA-Bottom-327 (70-3110) + BGA-Top-271 ZIF-CS (a) (70-2512A) or BGA-Bottom-327 (70-3110) + BGA-Top-284 ZIF (a) (70-2635A) or DIL48/BGA153-1.01 ZIF eMMC-3 (70-6331)
BeeProg3 adapter/module: AP3 BGA153-1.01 eMMC-1 (73-3040)
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