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Device: 1KL512Sxxxx00 [BGA24]

Manufacturer: Spansion

Part number description for this device:

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S Cypress(Spansion)  
XXXX Device Family 71KL = Cypress (Spansion) HyperBus MCP, 3.0 Volt-Only
XXX HyperFlash Density 128 = 128Mbit256 = 256Mbit512 = 512Mbit
X HyperFlash Device Technology S = 65 nm MirrorBit Process Technology
XX HyperRAM Density CO = 64MbitDG = 133MHz
X Package Type B = 24 ball FBGA 6x8mm package, 1.0mm pitch
X Package Materials H = Low-Halogen. Lead(Pb)-free
X Temperature Range I = Industrial (-40°C to 85°C)V = Industrial plus (-40°C to 105°C)
XX Model Number 00 = 100 MHz, FBGA, 24-ball, 6 x 8 x 1.0 mm package (VAA024)
X Packing Type 0Tray3 = 13\'\' Tape and reel

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL24/BGA24-2.02 ZIF HFlash-1 (70-6155) OR
BeeHive204AP adapter/module: AP1 BGA24-2 ZIF HFlash-1 (71-4509)
BeeHive208S adapter/module: DIL24/BGA24-2.02 ZIF HFlash-1 (70-6155) OR
BeeHive304 adapter/module: AP3 BGA24-2.02 HFlash-1 (73-6457) OR
BeeProg2 adapter/module: DIL24/BGA24-2.02 ZIF HFlash-1 (70-6155) OR
BeeProg2AP adapter/module: AP1 BGA24-2 ZIF HFlash-1 (71-4509)
BeeProg2C adapter/module: DIL24/BGA24-2.02 ZIF HFlash-1 (70-6155) OR
BeeProg3 adapter/module: AP3 BGA24-2.02 HFlash-1 (73-6457) OR
BeeHive204AP-AU (discontinued) adapter/module: AP1 BGA24-2 ZIF HFlash-1 (71-4509)
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