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XXXXX
Device Family
S4041 = Spansion e.MMC family
XXX
Density
008 = 8GB016 = 16GB
X
Revision
1 = Spansion MLC NAND
XX
Controller
B1 = e.MMC 4.51
XX
Package Type
B1 = FBGA 153, 13x11.5mmB2 = BGA 100, 18x14mm
X
Temperature Range
W = Super commercial (-25°C to 85°C)I = Industrial (-40°C to 85°C)
XX
Model Number
00 = 1 NAND Die01 = 2 NAND Die
X
Packing Type
0Tray3 = 13\'\' Tape and reel
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.