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Device: S71JL064H80Bxx01 [FBGA73]

Manufacturer: Spansion

Part number description for this device:

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S Spansion Memory  
XX Product Series 71 = Multi-chip product (MCP)73 = Stacked products (MCP)98 = Stacked Multi-chip product
X Flash Interface And Simultaneous Read-Write J = Standard, simultaneous read-writeA = Standard, no simultaneous read-writeP = Page, simultaneous read-writeG = Page, no simultaneous read-writeW = Burst (Demux add/data), simultaneous read-writeR = Burst (Demux add/data), no simultaneous read-writeN = Burst (Mux add/data), simultaneous read-writeK = Burst (Mux add/data), no simultaneous read-writeC = Automotive burst (Demux), simultaneous read-writeV = Simultaneous Read/Write, Burst mode with multiplexed I/O
X Core Voltage F = 5.0 V VccL = 3.0 V VccD = 2.5 V VccS = 1.8V Vcc
XXX Density 001-999 = 1Mb - 999Mb01G-64G = 1Gb - 64Gb
X Process Technology B = 320 nm, Floating gate technologyC = 320 nm, Floating gate technologyD = 200 nm, Floating gate technologyG = 170 nm, Floating gate technologyH = 130 nm, Floating gate technologyJ = 110 nm, Floating gate technologyM = 230 nm, MirrorBit technologyA = 200 nm MirrorBit technologyN = 110 nm, MirrorBit technologyP = 90 nm, MirrorBit technologyK = 90 nm, Floating gate technologyR = 65 nm, MirrorBit technology
XX pSRAM Density 04 = 4Mbit SRAM08 = 8Mbit SRAM0A = 16Mbit pSRAM40 = 4Mbit pSRAM80 = 8Mbit pSRAMA0 = 16Mbit pSRAMB0 = 32Mbit pSRAMC0 = 64Mbit pSRAMD0 = 128Mbit pSRAM
XX Package Type B = FBGAC = CSOP (Lead Frame)D = Die (Die/Wafer)E = Super CSP (BGA)F = Fortified BGAM = SOIC/SOP (Lead Frame)N = WSON (Lead Frame)T = TSOPS = SOPH = MCP FBGAK = POP FBGAJ = MCP FBGAZJ = Very thin fine-pitch BGA lead-free LF35 package
X Package Material Set BlankA = Standard, not lead (Pb)-freeF = Standard, lead (PB)-free
X Temperature Range BlankE = Engineering samplesC = Commercial (0°C to 70°C)W = Wireless (-25°C to 85°C)I = Industrial (-40°C to 85°C)N = Extended (-40°C to 125°C)
X Package Modifier Blank0, Q = 7x9mm, 1.2mm height, 56 balls9 = 8x11.6mm, 1.2mm height, 64 ballsT = 8x11.6mm, 1.4mm height, 84 ballsA = 8x11.6mm, 1.2mm height, 84 ballsE = 9x12mm, 1.2mm height, 84 ballsY = 9x12mm, 1.2mm height, 84 ballsK = 7.7x6.2mm, 56-Ball
X Model Number 1 BlankH = CellularRAM type 2, DYB=1, PPB=0S = CellularRAM type 2, DYB=1, PPB=1T = CellularRAM type 3, DYB=1, PPB=14 = SDR DRAM x16, Type 5
X Model Number 2 BlankV = 66MHz flash speedR = 80Mhz flash speedL = 108MHz flash speed
X Packing Type 0Tray1 = Tube2 = 7\\\'\\\' Tape & Reel3 = 13\'\' Tape & Reel

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-0246/0244 (70-0246/0244) = BGA-Bottom-2 (70-0246) + BGA-Top-4 ZIF-CS (70-0244)
BeeHive208S adapter/module: BGA-0246/0244 (70-0246/0244) = BGA-Bottom-2 (70-0246) + BGA-Top-4 ZIF-CS (70-0244)
BeeProg2 adapter/module: BGA-0246/0244 (70-0246/0244) = BGA-Bottom-2 (70-0246) + BGA-Top-4 ZIF-CS (70-0244)
BeeProg2C adapter/module: BGA-0246/0244 (70-0246/0244) = BGA-Bottom-2 (70-0246) + BGA-Top-4 ZIF-CS (70-0244)
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