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Device: S72XS256RD0AHBH [FBGA133]

Manufacturer: Spansion

Part number description for this device:

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S Spansion Memory  
XX Product Series 72 = Multi-chip product (MCP)
X Flash Interface And Simultaneous Read-Write J = Standard, simultaneous read-writeA = Standard, no simultaneous read-writeP = Page, simultaneous read-writeG = Page, no simultaneous read-writeW = Burst (Demux add/data), simultaneous read-writeR = Burst (Demux add/data), no simultaneous read-writeN = Burst (Mux add/data), simultaneous read-writeK = Burst (Mux add/data), no simultaneous read-writeC = Automotive burst (Demux), simultaneous read-writeV = Simultaneous Read/Write, Burst mode with multiplexed I/OX = Address-high, address-low, data multiplexed
X Core Voltage F = 5.0 V VccL = 3.0 V VccD = 2.5 V VccS = 1.8V Vcc
XXX Density 001-999 = 1Mb - 999Mb01G-64G = 1Gb - 64Gb
X Process Technology B = 320 nm, Floating gate technologyC = 320 nm, Floating gate technologyD = 200 nm, Floating gate technologyG = 170 nm, Floating gate technologyH = 130 nm, Floating gate technologyJ = 110 nm, Floating gate technologyM = 230 nm, MirrorBit technologyA = 200 nm MirrorBit technologyN = 110 nm, MirrorBit technologyP = 90 nm, MirrorBit technologyK = 90 nm, Floating gate technologyR = 65 nm, MirrorBit technology
XX DRAM and Data Flash Density D0 = 128Mb DRAM, no Data FlashE0 = 256Mb DRAM, no Data Flash
XX Package Type AF = Thin profile Fine-pitch BGA Pb-free package (0.5 mm pitch, 1.0 mm height)AJ = Thin profile Fine-pitch BGA Pb-free LF35 package (0.5 mm pitch, 1.0 mm height)ZJ = Thin profile Fine-pitch BGA Pb-free LF35 package (0.5 mm pitch, 1.2 mm height)
X Temperature Range BlankE = Engineering samplesC = Commercial (0°C to 70°C)W = Wireless (-25°C to 85°C)I = Industrial (-40°C to 85°C)N = Extended (-40°C to 125°C)
X Package Modifier 1 = DDR DRAM, 133-ball, 8.0x8.0 mm, FBGA multi-chip package7 = DDR DRAM, 133-ball, 11x10 mm, FBGA multi-chip package
X Model Number K = DRAM type 1, 66 MHz flash/133 Mhz DRAMJ = DRAM type 1, 80 MHz flash/133 MHz DRAM3 = DRAM type 5, 66 MHz flash/133 MHz DRAM2 = DRAM type 5, 80 MHz flash/133 MHz DRAM
X Packing Type 0Tray1 = Tube2 = 7\\\'\\\' Tape & Reel3 = 13\'\' Tape & Reel

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-1135/1051 (70-1135/1051) = BGA-Bottom-194 (70-1135) + BGA-Top-203 ZIF-CS (70-1051)
BeeHive208S adapter/module: BGA-1135/1051 (70-1135/1051) = BGA-Bottom-194 (70-1135) + BGA-Top-203 ZIF-CS (70-1051)
BeeProg2 adapter/module: BGA-1135/1051 (70-1135/1051) = BGA-Bottom-194 (70-1135) + BGA-Top-203 ZIF-CS (70-1051)
BeeProg2C adapter/module: BGA-1135/1051 (70-1135/1051) = BGA-Bottom-194 (70-1135) + BGA-Top-203 ZIF-CS (70-1051)
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