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Device: W29GL064CB [TFBGA48]

Manufacturer: Winbond

Part number description for this device:

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X Winbond Standard Product W = Winbond
XX Product Family 29GL = 3V flash
XXX Density 032 = 32Mb064 = 64Mb128 = 128Mb256 = 256Mb512 = 512Mb
X Product Version C = 90nmS = 58nmP = CMOS
X Sector Type H = EVIO=VCC=2.7V to 3.6V, uniform sector, highest address sector protectedEVIO=1.65V to VCC (2.7V to 3.6V), uniform sector, highest address sector protectedL = EVIO=VCC=2.7V to 3.6V, uniform sector, lowest address sector protectedEVIO=1.65V to VCC (2.7V to 3.6V), uniform sector, lowest address sector protectedT = Top boot sector, top two addressed sectors protectedB = Bottom boot sector, bottom two addressed sectors protected
X Access Time 7 = 70ns9 = 90ns1 = 110ns
X Package Type T = TSOP56, industrial (-40°C to 85°) and Green (RoHS compliant)B = LFBGA64, industrial (-40°C to 85°C) and Green (RoHS comliant)S = TSOP48, industrial (-40°C to 85°C) and Green (RoHS comliant)A = TFBGA48, industrial (-40°C to 85°C) and Green (RoHS comliant)

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-0245/0521 (70-0245/0521) = BGA-Bottom-1 (70-0245) + BGA-Top-69 ZIF-CS (70-0521)
BeeHive208S adapter/module: BGA-0245/0521 (70-0245/0521) = BGA-Bottom-1 (70-0245) + BGA-Top-69 ZIF-CS (70-0521)
BeeProg2 adapter/module: BGA-0245/0521 (70-0245/0521) = BGA-Bottom-1 (70-0245) + BGA-Top-69 ZIF-CS (70-0521)
BeeProg2C adapter/module: BGA-0245/0521 (70-0245/0521) = BGA-Bottom-1 (70-0245) + BGA-Top-69 ZIF-CS (70-0521)
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