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Device: W29N02GVBxAF [VFBGA63]

Manufacturer: Winbond

Part number description for this device:

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W Winbond Standard Product W = Winbond
29N Product Family 29N = ONFI compatible NAND flash family
XX Density 01 = 1Gbit02 = 2Gbit04 = 4Gbit08 = 8Gbit
X Product Version GHK
X Supply Voltage and Bus Width V = 2.7V to 3.6V and x8 deviceW = 1.7V to 1.95V and x16 deviceZ = 1.7V to 1.95V and x8 device
X Packages S = TSOP48D = VFBGA48B = VFBGA63Y = WLCSP68
X Temperatures Ranges C = 0°C to 70°CI = -40°C to 85°CJ = -40°C to 105°C
X Option Information A = OTP command supportedB = OTP command supportedN = General Product
X Reserved A = General product of single CE type, 1-bit ECCD = General product of dual CE type, 1-bit ECCE = 2kB page, 8-bit ECCF = 2kB page, 4-bit ECCG = 4kB page, 8-bit ECC

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL48/BGA63-1 ZIF NAND-1 (70-3105)
BeeHive204AP adapter/module: AP1 BGA63-1 ZIF NAND-1 (71-3669)
BeeHive208S adapter/module: DIL48/BGA63-1 ZIF NAND-1 (70-3105)
BeeHive304 adapter/module: AP3 BGA63-1.12 NAND-1 (73-3166) OR AP3 BGA63-1.13 CS NAND-1 (73-4250)
BeeProg2 adapter/module: DIL48/BGA63-1 ZIF NAND-1 (70-3105)
BeeProg2AP adapter/module: AP1 BGA63-1 ZIF NAND-1 (71-3669)
BeeProg2C adapter/module: DIL48/BGA63-1 ZIF NAND-1 (70-3105)
BeeProg3 adapter/module: AP3 BGA63-1.12 NAND-1 (73-3166) OR AP3 BGA63-1.13 CS NAND-1 (73-4250)
BeeHive204AP-AU (discontinued) adapter/module: AP1 BGA63-1 ZIF NAND-1 (71-3669)
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