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Device: W71NW21GD1DW [VFBGA130]

Manufacturer: Winbond

Part number description for this device:

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X Winbond Standard Product W = Winbond
XXX Product Family 71 = MCP product
XX Voltage NW = 1.8V ONFI NAND flash
X Product Density 1 = 1Gbit2 = 2Gbit
X NAND I/O bits 08bit1 = 16bit
X Flash Generation G = WEC 4X technology nodeH = WEC 4Xs technology node
X RAM density C = 512Mbit LPDDRD = 1Gbit LPDDRF = 1Gbit LPDDR2
X RAM Option Information 1 = 4X technology x163 = 4X technology x32
X Package Type D = 130 balls VFBGAE = 121 balls VFBGAF = 162 balls VFBGA
X Grate & Temperature Range W = Industrial (-40°C to 85°C)

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL48/BGA130-1 ZIF NAND-1 (70-3176)
BeeHive208S adapter/module: DIL48/BGA130-1 ZIF NAND-1 (70-3176)
BeeHive304 adapter/module: AP3 BGA130-1.10 NAND-1 (73-3169)
BeeProg2 adapter/module: DIL48/BGA130-1 ZIF NAND-1 (70-3176)
BeeProg2C adapter/module: DIL48/BGA130-1 ZIF NAND-1 (70-3176)
BeeProg3 adapter/module: AP3 BGA130-1.10 NAND-1 (73-3169)
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