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Device: 3DFN4G08VS1258 [SOP50] (MMFN08512801S-F)

Manufacturer: 3D Plus

Part number description for this device:

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3D 3D Plus Module  
XX Module Type DP = DPRAMEE = EEPROMFN = Flash NANDFO = Flash NORFR = FRAMMR = MRAMPO = PROMSF = StrataFlashSD = Synchronous RAMSR = Static RAM1D = DDR12D = DDR2
XXXX Module Density nnnK = nnn kilobitnnnM = nnn MegabitnnnG = nnn GigabitnnnT = nnn Terabit
XX Module Data Bit 04 = x4 bit08 = x8 bit16 = x16 bit32 = x32 bit40 = x40 bit48 = x48 bit64 = x64 bitnn = xnn bit
X Module Voltage C = 5.0 VV = 3.3VS = 2.8VT = 2.5VU = 1.8V
X Module Package B = BGAC = ConnectorJ = QFJP = PGAQ = QFPS = SOPW = Wire Bond
X Stacked Layers 1 = 1 layer2 = 2 layers4 = 4 layers8 = 8 layersn = n layersA = 10 layers
XXX Control Features / Flayer Reference nnn = Product flayer number
X Temperature Range C = 0°C to 70°CI = -40°C to 85°CM = -55°C to 125°CS = Specific
X Quality Level N = Commercial gradeB = Industrial gradeS = Space gradeC = Custom
X Space Screening Option Blank = ESA qualified (quality grade for space applications ECSS-Q-60-05C)P = NASA PEM selection (screening and qualification PEM-INST-001)
X Radiation Assurance R = Radiation data testedA = Generic radiation data available- = Not applicable
XX Speed / Access Time 00 = N/ASRAM10 = 10 ns12 = 12 ns15 = 15 ns20 = 20 nsMRAM35 = 35 nsFRAM60 = 60 nsSDRAM50 = 5 ns55 = 5.5 ns60 = 6 ns70 = 7 ns75 = 7.5 ns80 = 8 nsDDR- first digit:5 = 500 MHz6 = 166 MHz7 = 133 MHz8 = 100 MHz- second digit:C = CL = 3B = CL = 2.5A = CL = 2DDR2- first digit4 = DDR2-400 (200 MHz)5 = DDR2-533 (266 MHz)6 = DDR2-667 (333 MHz)8 = DDR2-800 (400 MHz)- second digit:A = CL = 3, tRCD = 3, tRP = 3C = CL = 4, tRCD = 4, tRP = 4E = CL = 5, tRCD = 5, tRP = 5G = CL = 6, tRCD = 6, tRP = 6FLASH03 = 30 ns05 = 50 ns07 = 70 ns08 = 80 ns09 = 90 ns10 = 100 ns11 = 110 ns12 = 120 ns25 = 25 ns35 = 35 ns
X Module Option Blank = No optionA = ARATHANE finishE = EPOTEK 302-3MH = Hermetic packageM = MAPSIL finishT = Tantalum shieldingW = WALOPACK shieldengX = XV501T4 finish solder

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL48/TSOP50 ZIF module 3D Plus NAND-1a (70-4375)
BeeHive204AP adapter/module: AP1 TSOP50 ZIF NAND module 3D Plus (71-1935)
BeeHive208S adapter/module: DIL48/TSOP50 ZIF module 3D Plus NAND-1a (70-4375)
BeeProg2 adapter/module: DIL48/TSOP50 ZIF module 3D Plus NAND-1a (70-4375)
BeeProg2AP adapter/module: AP1 TSOP50 ZIF NAND module 3D Plus (71-1935)
BeeProg2C adapter/module: DIL48/TSOP50 ZIF module 3D Plus NAND-1a (70-4375)
BeeHive204AP-AU (discontinued) adapter/module: AP1 TSOP50 ZIF NAND module 3D Plus (71-1935)
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