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X
Package Type
D = CerDIPN = PLCCP = Plastic DIPUX = Unencapsulated DIEL = LCCS = SOIC
X
Temperature Range
M = MilitaryE = ExtendedQ = Commercial
XX
Family Descriptor
28, 55 = EEPROM
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Technology
Blank = NMOSC = CMOSHC = High Speed CMOS
XX
Density
16A = 2kx864 = 8kx8010 = 128kx8256, 256A = 32kx8
X
EEPROM Byte Write Time
Blank = 10 msH = 2 ms
XXX
Access Time
150 = 150 ns200 = 200 ns250 = 250 ns300 = 300 ns
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X
Screening Option
B = MIL883 Class B screened
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
