BeeProg2

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Device: S25FL116KxxBxxS2 [BGA24] (Quad I/O)

Manufacturer: Spansion

Device type: SPI Flash

Part number description:	XXXXX XXX X XX X X X XX X
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XXXXX	Device Family	S25FL = Spansion Memory 3.0 Volt-only, Serial Peripheral Interface (SPI) Flash Memory
XXX	Density	204, 004 = 4Mbit 008, 208 = 8Mbit 016, 216 = 16Mbit 032 = 32Mbit 064 = 64Mbit 128 = 128Mbit
X	Density Technology	K = 0.09um process technology
XX	Speed	0X = 104MHz 0T = 85MHz 0R = 76MHz 0P = 65MHz 0S = 80MHz
X	Package Type	M = 8-pin SO package N = 8-contact WSON package B = 24-ball 6x8 mm BGA package, 1.0 mm pitch
X	Package Material	F = Lead (Pb)-free H = Low-halogen, Lead (Pb)-free
X	Temperature Range	I = Industrial (–40°C to +85°C) V = Automotive (–40°C to +105°C)
XX	Model Number (Additional Ordering Options)	04 = 8-pin SO package (150 mil) 01 = 8-pin SO package (208 mil) 00 = 16-pin SO package (300 mil) 02 = 5x5 ball BGA package 03 = 4x6 ball BGA package Q1 = 8-lead SO package (208 mil) / 8-contact WSON (Default quad mode enabled)
X	Packing Type	0Tray 1 = Tube 3 = 13'' Tape and Reel

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Supported by programmers and programming adapters/modules:

BeeHive304	adapter/module: AP3 BGA24-2 SFlash-1 (73-3165)
BeeProg3	adapter/module: AP3 BGA24-2 SFlash-1 (73-3165)

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exhibitions

okraj

NEPCON South China 2020

26th - 28th Aug 2020
Shenzhen Convention & Exhibition Center, China
booth no.: 9C06
exhibitor: Prosystems

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