| XXXXX |
Device Family |
AFS = Fusion devicesM7AFS = Fusion devices with ARM7M1AFS = Fusion devices with Cortex-M1A3P = ProASIC3 devicesM7A3P = ProASIC3 devices with ARM7M1A3P = ProASIC3 devices with Cortex-M1AGL = IGLOO devicesM1AGL = IGLOO devices with Cortex-M1A3PE = ProASIC3E devicesAGLE = IGLOO devicesM1AGLE = IGLOO devices with Cortex-M1AGLN = IGLOO nano devicesAGLP = IGLOO PLUS devicesA3PN = ProASIC3 nano devicesM1A3PE = ProASIC3E devices with Cortex-M1M7A3PE = ProASIC3E devices with ARM7P1AFS = Pigeon Point Fusion devicesU1AFS = MicroBlade Fusion devices |
| XXXX |
System Gates Count |
010 = 10000 system gates015 = 15000 system gates030 = 30000 system gates060 = 60000 system gates090 = 90000 system gates125 = 125000 system gates250 = 250000 system gates400 = 400000 system gates600 = 600000 system gates1000 = 1000000 system gates1500 = 1500000 system gates3000 = 3000000 system gates |
| X |
Power |
Blank = StandardL = Low-power |
| XX |
Supply Voltage |
BlankV2 = 1.2V to 1.5VV5 = 1.5V |
| X |
Enhanced Features |
Blank = StandardZ = Devices without enhanced features |
| X |
Speed Grade |
Blank = StandardF = 20% slower than standard1 = 15% faster than standard2 = 25% faster than standard |
| XX |
Package Type |
QN = Quad flat no lead (0.5mm pitch)PQ = Plastic quad flat pack (0.5mm pitch)FG = Fine pitch ball grid array (1.0mm pitch)VQ = Very thin quad flat pack (0.5mm pitch)TQ = Thin quad flat pack (0.5mm pitch)UC = Micro chip scale package (0.4mm pitch)CS = Chip scale package (0.5mm pitch) |
| X |
Lead-free Packaging Options |
Blank = Standard packagingG = RoHS-compliant (green) packaging |
| XXX |
Package Lead Count |
|
| X |
Application (Ambient Temperature Range) |
Blank = Commercial (0°C to 70°C)I = Industrial (-40°C to 85°C)PP = Pre-productionES = Engineering silicon (room temperature only) |
