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AT
Designator
XX
Product Family
XP = EcoXiP
XXX
Device Density
032 = 32Mbit128 = 128Mbit
X
Read-While-Write Option
R = Enabled
X
Package Option
CC = 24-ball 6x8x1.0 CBGADWF = Die in Wafer formU = WLCSP
X
Device Grade
H = Green, NiPdAu lead finish, industry temperature range (-40°C to 85°C)U = Green, Matte Sn or Sn alloy, industry temperature range (-40°C to 85°C
X
Operating Voltage
E = 1.65V to 1.95V
X
Shipping Carrier Option
Blank = WaferT = Tape and reelY = Tray
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
