XXX |
Device Type |
TMS = Commercial MOSSMJ = Military MOSTMX = Pre-production Commercial MOS |
XX |
Family Descriptor |
25 = EPROM27 = EPROM / OTP28 = 12V Flash EEPROM |
X |
Erasibility |
P = Non-erasable (OTP)Blank = Erasable |
X |
Technology |
C = CMOSF = CMOS Flash EEPROML = 10% Power Supply ToleranceLV = Low Voltage |
XXX |
Density |
08 = 1kx8010, 010A = 128kx816 = 2kx8020 = 256kx832 = 4kx8040 = 512kx864 = 8kx8110 = 32kx16128 = 16kx8210A = 64kx16240 = 256kx16256 = 32kx8257 = 32kx8291 = 2kx8292 = 2kx8400 = 512kx8 / 256kx16510 = 64kx8512 = 64kx8 |
XX |
Speed Option |
8, 80 = 80 ns10, 100 = 100 ns12, 120 = 120 ns1, 15, 150 = 150 ns1, 17, 170 = 170 ns2, 20, 200 = 200 nsBlank, 25, 250 = 250 ns30, 300 = 300 ns |
XX |
Package Type |
DD = Plastic TSOPDU = Reverse Plastic TSOPFM = Rectangular PLCCFN = Square PLCCJ = Ceramic DIPN = Plastic DIPPM = SQFP |
X |
Temperature Range |
L = 0°C to 70°CE = -40°C to 85°CQ = -40°C to 125°CT = -40°C to 110°CM = -55°C to 125°C |
X |
168 hour Burn-In Option |
4 = 168 hour Burn-InBlank = No Burn-In- for MilitaryBlank = 5004 Processing |