Move the cursor over the box to highlight particular section
Devices.
BW
Biwin
X
Device Type
E = eMMC 5.1
X
Package Size
F = 11.5x13mm
X
Balls Number
M = 153 ball
X
Grade
A = AutoGrade 2
XXXX
Density
8 = 8GB
X
Reserved
N
X
Controller Code
9
XX
NAND Code
RE
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
adapter/module: AP1 BGA153-1.01 eMMC-1 (71-3322) or AP1 BGA153-1.01 ZIF eMMC-3 (71-7247) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
adapter/module: AP3 BGA153-1.01 eMMC-1 (73-3040) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
adapter/module: AP1 BGA153-1.01 eMMC-1 (71-3322) or AP1 BGA153-1.01 ZIF eMMC-3 (71-7247) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
adapter/module: AP3 BGA153-1.01 eMMC-1 (73-3040) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
adapter/module: AP1 BGA153-1.01 eMMC-1 (71-3322) or AP1 BGA153-1.01 ZIF eMMC-3 (71-7247) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
