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Device: 25HS512TDx01 [SOIC16] (QuadSPI)

Manufacturer: Cypress

Part number description for this device:

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XXXX Device Family S25HS = Quad SPI high performance 1.8VS25HL = Quad SPI high performance 3.0V
XXX Density 256 = 256Mb512 = 512Mb01 = 1Gb
X Device Technology T = 45-nm MirrorBit process technology
XX Speed DP = 133 MHz SDR / 66 MHz DDRDS = 166 MHz SDR / 83 MHz DDRFA = 166 MHz SDR / 102 MHz DDR
X Package Type M = 16-pin SOICN = 8-contact WSON 6x8mmB = 24-ball 5x5 BGA, 1.00mm pitch
X Package Materials H = Low-Halogen, Lead (Pb)-free
X Grade / Temperature Range I = Industrial (–40 °C to + 85 °C)V = Industrial Plus (–40 °C to + 105 °C)A = Automotive, AEC-Q100 Grade 3 (–40 °C to +85 °C)B = Automotive, AEC-Q100 Grade 2 (–40 °C to +105 °C)M = Automotive, AEC-Q100 Grade 1 (–40 °C to +125 °C)
XX Model Number (Additional Ordering Options) 01 = BGA / WSON 6x8mm, SOIC-16 package03 = BGA 8x8mm package
X Packing Type 0Tray1 = Tube3 = 13\'\' Tape and reel

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive304 adapter/module: AP3 SOIC16-300 SFlash-1a (73-4441) OR
BeeProg3 adapter/module: AP3 SOIC16-300 SFlash-1a (73-4441) OR
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