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Device: EM6503

Manufacturer: EM Microelectronic

Part number description for this device:

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EM EM Microelectronic – Marin SA  
65XX Device Number 65036504650565176520652165226540
XXX Customer Version - customer-specific number given by EM Microelectronic
XXXX Package/Die form DL24 = 24 pin DIPDL28 = 28 pin DIPSO8 = 8 pin SOICSO16 = 16 pin SOICSO18 = 18 pin SOICSO24 = 24 pin SOICSO28 = 28 pin SOICSO32 = 32 pin SOICTP8 = 8 pin TSSOPTP16 = 16 pin TSSOPTP24 = 24 pin TSSOPTP28 = 28 pin TSSOPTQ32 = 32 pin TQFPTQ44 = 44 pin TQFPTQ52 = 52 pin TQFPTQ64 = 64 pin TQFPWP = Waffle packWS = Sawn wafer/frameWW = Wafer
X Delivery form/Thickness A = StickB = Tape&ReelD = Trays (Plate)11 = 11 mils (280um), by default27 = 27 mils (686um), not backlapped

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 direct connection
BeeHive208S direct connection
BeeProg2 direct connection
BeeProg2C direct connection
SmartProg2 direct connection
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