BeeProg2

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Device: EM6540 (ISP)

Manufacturer: EM Microelectronic

Part number description:	EM 65XX XXX XXXX X
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EM	EM Microelectronic – Marin SA
65XX	Device Number	6503 6504 6505 6517 6520 6521 6522 6540
XXX	Customer Version	- customer-specific number given by EM Microelectronic
XXXX	Package/Die form	DL24 = 24 pin DIP DL28 = 28 pin DIP SO8 = 8 pin SOIC SO16 = 16 pin SOIC SO18 = 18 pin SOIC SO24 = 24 pin SOIC SO28 = 28 pin SOIC SO32 = 32 pin SOIC TP8 = 8 pin TSSOP TP16 = 16 pin TSSOP TP24 = 24 pin TSSOP TP28 = 28 pin TSSOP TQ32 = 32 pin TQFP TQ44 = 44 pin TQFP TQ52 = 52 pin TQFP TQ64 = 64 pin TQFP WP = Waffle pack WS = Sawn wafer/frame WW = Wafer
X	Delivery form/Thickness	A = Stick B = Tape&Reel D = Trays (Plate) 11 = 11 mils (280um), by default 27 = 27 mils (686um), not backlapped

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Supported by programmers and programming adapters/modules:

BeeHive204	adapter/module: Note: via ISP connector
BeeHive204AP	adapter/module: Note: via ISP connector
BeeHive208S	adapter/module: Note: via ISP connector
BeeProg2	adapter/module: Note: via ISP connector
BeeProg2AP	adapter/module: Note: via ISP connector
BeeProg2C	adapter/module: Note: via ISP connector
SmartProg2	adapter/module: Note: via ISP connector
BeeHive204AP-AU (discontinued)	adapter/module: Note: via ISP connector
BeeProg+ (discontinued)	adapter/module: Note: via ISP connector

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exhibitions

okraj

NEPCON ASIA

25th - 27th Aug 2021
Shenzhen Convention and Exhibition Center, China
hall no.: A
booth no.: 1K06
exhibitor: Prosystems

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