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Device: FM29LF08I3 [FBGA63]

Manufacturer: Fudan Microelect.

Part number description for this device:

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Devices.
XX Company Prefix FM = Fudan Microelectronics Group Co., Ltd.
XXX Product Family 25S = 3.3V SPI NAND flash
25LS = 1.8V SPI NAND flash
29F = 3.3V PPI NAND flash
29LF = 1.8V PPI NAND flash
XX Product Density 01 = 1Gbit
02 = 2Gbit
04 = 4Gbit
08 = 8Gbit
XXX Product Version I3
BI3
XX Package Type TP = TSOP48 (12x20mm)
BGA = BGA63 (9x11mm)
DND = TDFN8 (8x6mm)
X Product Carrier A = Tray
T = Reel
X HSF ID Code G = RoHS compliant, halogen-free, antimony-free
X MSL Level 3 = MSL3

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

Supported by programmers and programming adapters/modules.
BeeHive204 adapter/module: DIL48/BGA63-1 ZIF NAND-1 (70-3105)
BeeHive204AP adapter/module: AP1 BGA63-1 ZIF NAND-1 (71-3669)
BeeHive208S adapter/module: DIL48/BGA63-1 ZIF NAND-1 (70-3105)
BeeProg2 adapter/module: DIL48/BGA63-1 ZIF NAND-1 (70-3105)
BeeProg2AP adapter/module: AP1 BGA63-1 ZIF NAND-1 (71-3669)
BeeProg2C adapter/module: DIL48/BGA63-1 ZIF NAND-1 (70-3105)
BeeHive204AP-AU (discontinued) adapter/module: AP1 BGA63-1 ZIF NAND-1 (71-3669)
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