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Device: 27C256

Manufacturer: General Instrument

Part number description for this device:

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XX Family Designator 27 = EPROM memory
XX Technology BlankHC = High Speed CMOSC = CMOS
XXX Density 04 = 512x816 = 2kx864 = 8kx8128 = 16kx8256 = 32kx8512 = 64kx8513 = PAGE641 = 8kx81024 = 128kx8 / 64kx16
X Power Supply L = Low Power
XX Access Time 15 = 150 ns17 = 170 ns20 = 200 ns25 = 250 ns
X Temperature Range Blank, C = CommercialI = IndustrialM = Military
X Screening Blank = Standard commercial screeningR = Screening per MIL STD 883C Method 5004
XX Package Type Blank = CerDIPP = Plastic DIPD = Sidebrazed ceramicKA = Ceramic LCCKB = Ceramic LCC, thermally enchanceL = PLCC

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive304 adapter/module: AP3 DIL48 (73-3319)
BeeProg3 adapter/module: AP3 DIL48 (73-3319)
MEMprog2 (discontinued)
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