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Device: 28C04

Manufacturer: General Instrument

Part number description for this device:

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XX Family Designator 28 = EEPROM memory
X Technology C = CMOS
XXX Density 04, 04F = 512x816, 016F, 17, 017F = 2kx864 = 8kx8
X Option Blank = tWC=1ms, 104 cyclesX = tWC=1ms, no connect pin1 DIP, pin2 LCC/PLCC
XX Speed 15 = 150 ns20 = 200 ns25 = 250 ns
X Temperature Tange Blank = CommercialI = IndustrialM = Military
X Screening Blank = Std. commercial/industrialR = MIL-STD-833, Method 5004
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X Package P = Plastic DIPJ = CerDIPW = Die in Waffer FormS = Die in Waffle PackL = PLCCK = Ceramic LCC

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 direct connection
BeeHive208S direct connection
BeeProg2 direct connection
BeeProg2C direct connection
SmartProg2 direct connection
MEMprog2 (discontinued) direct connection
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