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Device: HY27UG082G2M [TSOP48]

Manufacturer: Hynix

Part number description for this device:

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HY Hynix Memory  
27 Device Family 27 = NAND Flash
X Power Supply U = 2.7V to 3.6VL = 2.7VS = 1.8V
X Classification S = Single Level Cell + Single Die + S/BA = Single Level Cell + Double Die + S/BB = Single Level Cell + Quadruple Die + S/BF = Single Level Cell + Single Die + L/BG = Single Level Cell + Double Die + L/BH = Single Level Cell + Quadruple Die + L/BM = Multi Level Cell + Single Die + S/BO = Multi Level Cell + Double Die + S/BP = Multi Level Cell + Quadruple Die + S/BT = Multi Level Cell + Single Die + L/BU = Multi Level Cell + Double Die + L/BV = Multi Level Cell + Quadruple Die + L/BW = Multi Level Cell + L/B
XX Bit Organization 08 = x816 = x1632 = x32
XX Density 64 = 64Mbit28 = 128Mbit56 = 256Mbit12 = 512Mbit1G = 1Gbit2G = 2Gbit4G = 4Gbit8G = 8GbitAG = 16GbitBG = 32GbitCG = 64GbitDG = 128Gbit
X Mode 1 = 1nCE & 1R/nB; Sequencial Row Read Enable2 = 1nCE & 1R/nB; Sequencial Row Read Disable4 = 2nCE & 2R/nB; Sequencial Row Read Enable5 = 2nCE & 2R/nB; Sequencial Row Read Disable6 = 1nCE &1R/nB; Sequencial Row Read Enable & Auto Read Page 07 = 2nCE & 2R/nB; Sequencial Row Read Enable & Auto Read Page 08 = 1nCE &1R/nB; Sequencial Row Read Disable & Auto Read Page 09 = 2nCE &2R/nB; Sequencial Row Read Disable & Auto Read Page 0D = Dual interface; Sequential Row Read DisableF = 4nCE & 4R/B; Sequencial Row Read Disable
X Version M = 1st GenerationA = 2nd GenerationB = 3rd GenerationC = 4th Generation1 = Down Density (1st)2 = Down Density (2nd)
X Package Type T = TSOPV = WSOPS = USOPF = FBGA (63ball)B = FBGA (107ball)G = FBGA (149ball)H = TBGAL = LGAU = ULGAW = WaferC = ChipK = KGBD = PGD2
X Package Material Blank = Normal, Wafer, Chip, KGBP = Lead FreeH = Halogen FreeR = Lead & Halogen Free
X Operating Temperature Blank = Wafer, ChipC = 0°C to 70°CE = -25°C to 85°CM = -30°C to 85°CI = -40°C to 85°C
X Bad Block Blank = WaferB = Included Bad BlockS = 1 - 5 Bad BlockP = All Good Block
X Customer Initial Option  

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081)
BeeHive204AP adapter/module: AP1 TSOP48 ZIF 18.4mm NAND-3 (71-3097)
BeeHive208S adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081)
BeeProg2 adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081)
BeeProg2AP adapter/module: AP1 TSOP48 ZIF 18.4mm NAND-3 (71-3097)
BeeProg2C adapter/module: DIL48/TSOP48 ZIF 18.4mm NAND-3 (70-3081)
BeeHive204AP-AU (discontinued) adapter/module: AP1 TSOP48 ZIF 18.4mm NAND-3 (71-3097)
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