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Device: 10M16DC [UBGA324](Jam)

Manufacturer: Intel

Part number description for this device:

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XX Family Signature 10M = MAX 10
XX Member Code 02 = 2K logic elements
04 = 4K logic elements
08 = 8K logic elements
16 = 16K logic elements
25 = 25K logic elements
40 = 40K logic elements
50 = 50K logic elements
XX Feature Options SC = Single supply, compact features
SF = Single supply, flash features
SA = Single supply, analog features
SL = Single supply, flash features with RSU option
DC = Dual supply, compact features
DF = Dual supply, flash features
DA = Dual supply, analog features
DD = Dual supply, analog and flash features with RSU option and flash access control
X Package Type V, Y = Wafer-level chip scale (WLCSP)
E = Plastic enhanced quad flat pack (EQFP)
M = Micro FineLine BGA (MBGA)
U = Ultra FineLine BGA (UBGA)
F = FineLine BGA (FBGA)
XXX Package Code WLCSP package type:
36 = 36-ball, 3mm x 3mm
81 = 81-ball, 4mm x 4mm
180 = 180-ball, 6mm x 5mm
EQFP package type:
144 = 144-pin, 22mm x 22mm
MBGA package type:
153 = 153-ball, 8mm x 8mm
UBGA package type:
169 = 169-ball, 11mm x 11mm
324 = 324-ball, 15mm x 15mm
FBGA package type:
256 = 256-ball, 17mm x 17mm
484 = 484-ball, 23mm x 23mm
672 = 672-ball, 27mm x 27mm
X Operating Temperature C = Commercial (0°C to 85°C)
I = Industrial (-40°C to 100°C)
A = Automotive (-40°C to 125°C)
X FPGA Fabric Speed Grade 6 = fastest
7
8
X Optional Suffix - indicates specific device options or shipment method
G = RoHS6
ES = Engineering sample
P = Leaded package

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: BGA-3969/3970 (70-3969/3970) = BGA-Bottom-392 (70-3969) + BGA-Top-392 ZIF (70-3970)
BeeHive208S adapter/module: BGA-3969/3970 (70-3969/3970) = BGA-Bottom-392 (70-3969) + BGA-Top-392 ZIF (70-3970)
BeeHive304 adapter/module: AP3 BGA324-2 PLD-1 (73-4078)
BeeProg2 adapter/module: BGA-3969/3970 (70-3969/3970) = BGA-Bottom-392 (70-3969) + BGA-Top-392 ZIF (70-3970)
BeeProg2C adapter/module: BGA-3969/3970 (70-3969/3970) = BGA-Bottom-392 (70-3969) + BGA-Top-392 ZIF (70-3970)
BeeProg3 adapter/module: AP3 BGA324-2 PLD-1 (73-4078)
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