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Device: X28C010

Manufacturer: Intersil

Part number description for this device:

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X Xicor  
XX Family Descriptor 28 = EEPROM
X Technology Blank = NMOSC = CMOSHC = High perfomance CMOSLV = Low-voltage CMOSTC = Fast Column Access EEPROMVC = Byte Alterable EEPROM
XXX Density 04A = 512x816A, 16B, 16C = 2kx8010 = 128kx864, 64A, 64B, 64H = 8kx8256 = 32kx8512 = 64kx8
XX Temperature Range Blank = CommercialI = IndustrialM = MilitaryMHR = Military high rel. processingMB = MIL-STD-883
X Package Type P = Plastic DIPJ = PLCCD = CerDIPE = Ceramic LCCS = SOICF = Flat PackK = Pin Grid ArrayR = Ceramic SOICN = Stretched Ceramic LCCT = TSOPL = TQFP
XX Access Time Blank = 300 ns25 = 250 ns20 = 200 ns15 = 150 ns90 = 90 ns70 = 70 ns55 = 55 ns45 = 45 ns35 = 35 ns
XX Option T1 = Tape&Reel

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 direct connection
BeeHive208S direct connection
BeeProg2 direct connection
BeeProg2C direct connection
SmartProg2 direct connection
MEMprog2 (discontinued) direct connection
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