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Device: JSFBBB3YHABBG-4 [FBGA162]

Manufacturer: Jeju Semiconductor

Part number description for this device:

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JSF JSC NAND MCP Solution  
X NAND Flash Density A = 1GbitB = 2GbitC = 4Gbit
X DRAM Density 8 = 256Mbit9 = 512MbitA = 1GbitB = 2GbitC = 4Gbit
X Organization A = x8(NAND) + x16(DRAM)B = x8(NAND) + x32(DRAM)C = x16(NAND) + x16(DRAM)D = x16(NAND) + x32(DRAM)K = x8(NAND) + x32(DRAM)M = x16(NAND) + x32(DRAM)
X Combination Type 1 = SLC NAND + LPSDR2 = SLC NAND + LPDDR3 = SLC NAND + LPDDR2
X Voltage N = 1.8V NAND +1.8V DRAMY = 1.8V NAND + 1.8V/1.2V DRAM
XXX MCP Version  
XX Package BA = 130 ball FBGABB = 107 ball FBGABC = 137 ball FBGABD = 162 ball FBGA (11.5x13)BE = 121 ball FBGA (8x8)BG = 162 ball FBGA (8x10.5x0.8)BL = 162 ball FBGA (8x10.5x1.1)
X NAND Flash Speed 4 = 45ns
XX DRAM Speed 60 = 6ns(166MHz)50 = 5ns(200MHz)25 = 2.5ns(400Mhz)
X Temperature I = SpecialM = Automotive (-40°C to 105°C)

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL48/BGA162-2 ZIF NAND-1 (70-3276)
BeeHive204AP adapter/module: AP1 BGA162-2 ZIF NAND-1 (71-4239)
BeeHive208S adapter/module: DIL48/BGA162-2 ZIF NAND-1 (70-3276)
BeeHive304 adapter/module: AP3 BGA162-2.10 NAND-1 (73-4891)
BeeProg2 adapter/module: DIL48/BGA162-2 ZIF NAND-1 (70-3276)
BeeProg2AP adapter/module: AP1 BGA162-2 ZIF NAND-1 (71-4239)
BeeProg2C adapter/module: DIL48/BGA162-2 ZIF NAND-1 (70-3276)
BeeProg3 adapter/module: AP3 BGA162-2.10 NAND-1 (73-4891)
BeeHive204AP-AU (discontinued) adapter/module: AP1 BGA162-2 ZIF NAND-1 (71-4239)
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