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MLX
Melexis
XXXXX
Part Number
X
Temperature Code
K = -40°C to 125°C
X
Package Code
DC = SOIC 150milLW = QFN, wettable flanks
X
Major Hardware Design Revision
XX
ROM Code Revision
XXX
Flash Content (Version of Bootloader)
XX
Packing Form Code
RE = Reel
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.
