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Device: MT29F1G16ABBDAH4-IT [VFBGA63] (EPS-9)

Manufacturer: Micron

Part number description for this device:

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MT Micron Technology  
XXX Product Family 29F = Single-supply NAND flash29E = Enterprise NAND flash29H = High-speed NAND flash
XX Density 1G = 1Gbit2G = 2Gbit4G = 4Gbit8G = 8Gbit16G = 16Gbit32G = 32Gbit64G = 64Gbit128G = 128Gbit256G = 256Gbit512G = 512Gbit1T = 1Tbit2T = 2Tbit4T = 4Tbit
XX Device Width 01 = 1bit08 = 8 bits16 = 16bits
X Level A = SLCB = ReservedC = MLC-2E = TLC
X Classification A = 1 die, 0 nCE, 0 RnB, 1 I/O channelB = 1 die, 1 nCE, 0 RnB, 1 I/O channelD = 2 dies, 1 nCE, 1RnB, 1 I/O channelE = 2 dies, 2 nCE, 2 RnB, 2 I/O channelsF = 2 dies, 2 nCE, 2 RnB, 1 I/O channelG = 3 dies, 3 nCE, 3 RnB, 3 I/O channelsJ = 4 dies, 2 nCE, 2 RnB, 1 I/O channelK = 4 dies, 2 nCE, 2 RnB, 2 I/O channelsL = 4 dies, 4 nCE, 4 RnB, 4 I/O channelM = 4 dies, 4 nCE, 4 RnB, 2 I/O channelsQ = 8 dies, 4 nCE, 4 RnB, 4 I/O channelR = 8 dies, 2 nCE, 2 RnB, 2 I/O channelsT = 16 dies, 8 nCE, 4 RnB, 2 I/O channelU = 8 dies, 4 nCE, 4 RnB, 2 I/O channelsV = 16 dies, 8 nCE, 4RnB, 4 I/O channels
X Operating Voltage Range A = Vcc: 3.3V (2.70V to 3.60V), Vccq: 3.3V (2.70V to 3.60V)B = Vcc: 1.8V (1.70V to 1.95V), Vccq: 1.8V (1.70V to 1.95V)C = Vcc: 3.3V (2.70V to 3.60V), Vccq: 1.8V (1.70V to 1.95V)E = Vcc: 3.3V (2.70V to 3.60V), Vccq: 3.3V (2.70V to 3.60V) or1.8V (1.70V to 1.95V)F = Vcc: 3.3V (2.50V to 3.60V), Vccq: 1.2V (1.14V to 1.26V)G = Vcc: 3.3V (2.60V to 3.60V), Vccq: 1.8V (1.70V to 1.95V)H = Vcc: 3.3V (2.50V to 3.60V), Vccq: 1.2V (1.14V to 1.26V) or1.8V (1.70V to 1.95V)J = Vcc: 3.3V (2.50V to 3.60V), Vccq: 1.8V (1.70V to 1.95V)K = Vcc: 3.3V (2.60V to 3.60V), Vccq: 3.3V (2.60V to 3.60V)L = Vcc: 3.3V (2.60V to 3.60V), Vccq: 3.3V (2.60V to 3.60V) or1.8V (1.70V to 1.95V)
X Generation Feature Set A = 1-st set of device featuresB = 2-nd set of device features (only if different than 1-st set)C = 3-rd set of device features (only if different)D = 4-th set of device features (only if different)etc.
X Interface A = Asynchronous onlyB = Synchronous/AsynchronousC = Synchronous onlyD = SPI
XX Package Code SF = 16-pin SOP, 300milsWP = 48-pin TSOP I (CPL version, Pb-free)WC = 48-pin TSOP I (OCPL version, Pb-free)WB = 8-pin U-PDFN, 6x8x0.65C3 = 52-pad ULGA, 12x17x0.65C4 = 52-pad VLGA, 12x17x1.0(SDP/DDP/QDP)C5 = 52-pad VLGA, 14x18x1.0(SDP/DDP/QDP)C6 = 52-pad LLGA, 14x18x1.47(DDP/QDP/8DP)C7 = 48-pad LLGA, 12x20x1.47(8DP)C8 = 52-pad WLGA, 14x18x0.75(DDP/QDP)G1 = 272-ball VBGA, 14x18x1.0 (SDP, DDP, 3DP, QDP)G2 = 272-ball VBGA, 14x18x1.3 (QDP, 8DP)G6 = 272-ball VBGA, 14x18x1.5 (16DP)H1 = 100-ball VBGA (Pb-free), 12x18x1.0H2 = 100-ball TBGA (Pb-free), 12x18x1.2H3 = 100-ball LBGA (Pb-free), 12x18x1.4 (DDP/QDP/8DP)H4 = 63-ball VFBGA, 9x11x1HC = 63-ball VFBGA, 10.5x13x1.0H6 = 152-ball VBGA, 14x18x1.0 (SDP, DDP)H7 = 152-ball TBGA, 14x18x1.2 (QDP)H8 = 152-ball LBGA, 14x18x1.4 (8DP)H9 = 100-ball LBGA, 12x18x1.6 (16DP)J1 = 132-ball VBGA, 12x18x1.0 (SDP, DDP)J2 = 132-ball TBGA, 12x18x1.2 (QDP)J3 = 132-ball LBGA, 12x18x1.4 (8DP)J4 = 132-ball VBGA, 12x18x1.0 (SDP, DDP)J5 = 132-ball TBGA, 12x18x1.2 (QDP)J6 = 132-ball LBGA, 12x18x1.4 (8DP)J7 = 152-ball LBGA, 14x18x1.5 (16DP)J9 = 132-ball LBGA, 12x18x1.5 (16DP)12 = 24-ball T-PBGA, 6x8x1.5
XX Speed Grade (Synchronous) Blank = Asynchronous only20 = 100MT/s15 = 133MT/s12 = 166MT/s10 = 200MT/s6 = 333MT/s5 = 400MT/s4 = 533MT/s3 = 667MT/s
XX Temperature Range Blank = Commercial (0°C to 70°C)AAT = Automotive Industrial (-40°C to 105°C)AIT = Automotive Industrial (-40°C to 85°C)IT = Extended (-40°C to 85°C)WT = Wirelles (-25°C to 85°C)
X Special Options E = Error correction with internal ECC enabledM = MediaR = MLC+FeaturesX = Premium lifecycle product (PLP)S = Security featuresZ = Polyimide (if applicable)
XX Production Status Blank = ProductionES = Engineering samplesQS = Qualification samplesMS = Mechanical samples
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X Design Revision (Shrink) A = 1-st design revisionB = 2-nd design revisionetc.

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL48/BGA63-1 ZIF NAND-1 (70-3105) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
BeeHive204AP adapter/module: AP1 BGA63-1 ZIF NAND-1 (71-3669) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
BeeHive208S adapter/module: DIL48/BGA63-1 ZIF NAND-1 (70-3105) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
BeeProg2 adapter/module: DIL48/BGA63-1 ZIF NAND-1 (70-3105) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
BeeProg2AP adapter/module: AP1 BGA63-1 ZIF NAND-1 (71-3669) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
BeeProg2C adapter/module: DIL48/BGA63-1 ZIF NAND-1 (70-3105) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
BeeHive204AP-AU (discontinued) adapter/module: AP1 BGA63-1 ZIF NAND-1 (71-3669) Support of this chip is restricted to some programmer[s] only. Contact manufacturer of programmer for details.
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