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Device: SPC5744PxxxxMM [MAPBGA257]

Manufacturer: NXP

Part number description for this device:

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X Qualification Status P = Engineering samplesM = Fully spec.qualified, general market flowS = Fully spec.qualified, automotive market flow
PC Power Architecture  
XX Automotive Platform 57 = Power Architecture in 55nm
X Core Version 4 = e200z4 core version
X Flash Memory Size 1 = 1MB2 = 1.5MB3 = 2MB4 = 2.5MB6 = 3MB7 = 4MB8 = 6MB
X Product Version P = SafeAssure solution
X Optional Fields Blank = Feature not availableE = EthernetF = FlexRayG = Ethernet + FlexRay
XX Fab and Mask Version Indicator K = TSMC Fab# = Version of maskset00N65H1 = 1N81M0A = 0N78S
X Temperature Range C = -40°C to 85°CV = -40°C to 105°CM = -40°C to 125°CK = -40°C to 135°C for extended temp (+165°C Tj)
X Package Code LQ = 144 LQFPKU = 176 LQFP EPMJ = 256 MAPBGAMM = 257 MAPBGAMN = 324 MAPBGA
XX CPU Frequency 5 = 150MHz8 = 180MHz9 = 200MHz
X Shipping Method Blank = TrayR = Tape and reel

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive304 adapter/module: AP3 BGA257-1 xPC57-3 (73-5985)
BeeProg3 adapter/module: AP3 BGA257-1 xPC57-3 (73-5985)
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