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Device: NM9A02G08AF [FBGA63]

Manufacturer: NeuMem

Part number description for this device:

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XX Manufacturer NM = NeuMem
XX Product Family 5A = SPI NAND flash with internal ECC5F = SPI NAND flash without internal ECC9A = Parallel NAND flash with internal ECC9F = Parallel NAND flash without internal ECC
XXX Density 01G = 1Gbit02G = 2Gbit
XX Organization 01 = x108 = x816 = x16
X Product Version A = A-versionB = B-versionC = C-version
X Package Type B = FBGA24D = DIP8 300milF = FBGA63P = SOP16 300milQ = WSON8 (6x5mm)S = SOP8 208milU = USON8 (4x4mm, 0.45mm thickness)W = WaferY = WSON8 (8x6mm)Z = TFBGA24 (6x4ball array)
X Temperature Range C = Commercial (0°C to 70°C)I = Industrial (-40C to 85°C)J = Industrial (-40°C to 105°C)A = Automotive (-40°C to 125°C)
X Green Code G = Pb free & halogen free green package
X Packign Type T or no mark = TubeY = TrayR = Tape & Reel

Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.

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Supported by programmers and programming adapters/modules:

BeeHive204 adapter/module: DIL48/BGA63-1 ZIF NAND-1 (70-3105)
BeeHive204AP adapter/module: AP1 BGA63-1 ZIF NAND-1 (71-3669)
BeeHive208S adapter/module: DIL48/BGA63-1 ZIF NAND-1 (70-3105)
BeeHive304 adapter/module: AP3 BGA63-1.12 NAND-1 (73-3166) OR AP3 BGA63-1.13 CS NAND-1 (73-4250)
BeeProg2 adapter/module: DIL48/BGA63-1 ZIF NAND-1 (70-3105)
BeeProg2AP adapter/module: AP1 BGA63-1 ZIF NAND-1 (71-3669)
BeeProg2C adapter/module: DIL48/BGA63-1 ZIF NAND-1 (70-3105)
BeeProg3 adapter/module: AP3 BGA63-1.12 NAND-1 (73-3166) OR AP3 BGA63-1.13 CS NAND-1 (73-4250)
BeeHive204AP-AU (discontinued) adapter/module: AP1 BGA63-1 ZIF NAND-1 (71-3669)
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